M1A3P1000-1FGG144

The M1A3P1000-1FGG144 is a Microchip ProASIC3 field programmable gate array (FPGA) supplied in a 144-ball FPBGA (13×13) tray package. It provides a highly configurable logic fabric with 24,576 logic elements, approximately 0.144 Mbits of embedded memory, and 97 user I/Os—designed for commercial-temperature, surface-mount applications that require reprogrammable logic and on-chip nonvolatile storage characteristics.

Key Features

• Programmable Logic — 24,576 logic elements (cells) supporting system-level integration of custom logic and state machines.
• Logic Density — Approximately 1,000,000 system gates for implementing mid-range digital designs and control logic.
• Embedded Memory — Total of 144,000 bits of on-chip RAM (approximately 0.144 Mbits) for FIFOs, buffers, and small data storage.
• Rich I/O Count — 97 user I/Os with mixed-voltage support noted in the ProASIC3 family datasheet for flexible connectivity across voltage domains.
• Security and In-System Programming — Series-level features include on-chip AES decryption for secure in-system programming and FlashLock protection as described in the ProASIC3 documentation.
• Power and Supply — Specified device supply voltage: 1.425 V nominal.
• Package and Mounting — 144-FPBGA (13×13) supplier package, surface-mount package case supplied in tray format for production assembly.
• Commercial Temperature Grade — Operating range from 0 °C to 85 °C, suitable for commercial electronics and consumer products.

Typical Applications

• Consumer Electronics — Implement display controllers, protocol bridging, and user interface logic where compact, reprogrammable logic is required.
• Portable and Battery-Powered Devices — Low-power FPGA functions and instant-on design patterns can be applied to feature-rich portable products.
• Industrial Control (Commercial Grade) — Control logic, I/O aggregation, and state-machine implementations within commercial-temperature equipment.
• Embedded System Prototyping — Rapid hardware iteration, algorithm offload, and interface prototyping using on-chip logic and RAM.

Unique Advantages

• High Logic Capacity: 24,576 logic elements enable consolidation of multiple discrete functions into a single FPGA, reducing board-level component count.
• On-Chip Memory: Approximately 0.144 Mbits of embedded RAM supports local buffering and FIFO implementations without external memory.
• Secure In-System Updates: On-chip AES-based ISP and FlashLock features (as provided in the ProASIC3 family) allow secure programming and content protection.
• Compact BGA Package: 144-ball FPBGA (13×13) packaging delivers a small PCB footprint for space-constrained designs while supporting surface-mount manufacturing.
• Commercial Temperature Support: Rated 0 °C to 85 °C to match typical consumer and commercial product environments.
• Flexible I/O Count: 97 user I/Os provide broad interfacing options for sensors, peripherals, and external controllers.

Why Choose M1A3P1000-1FGG144?

The M1A3P1000-1FGG144 balances mid-range logic capacity with embedded memory and a substantial I/O count to address a wide range of commercial applications. Its reprogrammable nature and series-level security features enable secure in-system updates and iterative development without changing hardware. The compact 144-FPBGA package and surface-mount mounting make it suitable for space-conscious designs where integration and reduced BOM are priorities.

Designers and procurement teams looking for a commercially graded, reprogrammable FPGA with measurable logic density, on-chip RAM, and extensive I/O capability will find the M1A3P1000-1FGG144 a practical option for consolidation of control, interfacing, and custom logic tasks within commercial electronic products.

Request a quote or submit an inquiry to get pricing and availability for the M1A3P1000-1FGG144 and support for integration into your next design.