M1A3P1000-1FG256

The M1A3P1000-1FG256 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology. It delivers up to 1,000,000 gates implemented across 24,576 logic elements and provides 177 user I/O signals in a compact 256-LBGA package.

Designed for commercial embedded systems, this low-power flash-based FPGA targets designs that require a balance of logic density, moderate embedded memory, and flexible I/O in a space-efficient package. The device operates from a core supply range of 1.425 V to 1.575 V and supports an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Performance — Up to 1,000,000 gates implemented across 24,576 logic elements to support complex custom digital logic and glue-logic integration.
• Embedded Memory — Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for small to moderate buffering, state machines, and table storage.
• I/O Capacity — 177 user I/O pins to support multiple parallel interfaces, buses, and peripheral connections.
• Flash-Based Architecture — Series-level Flash*Freeze technology referenced in the ProASIC3 family documentation for flash-based configuration and low-power operation.
• Power and Voltage — Core voltage supply range of 1.425 V to 1.575 V for precise power provisioning in embedded designs.
• Package — 256-LBGA (supplier device package: 256-FPBGA, 17×17) providing a compact, high-density footprint for board-level integration.
• Operating Temperature — Commercial temperature grade with an operating range of 0 °C to 85 °C suitable for standard commercial environments.
• Mounting Type — Surface mount package format for standard PCB assembly processes.

Typical Applications

• Embedded Control and Glue Logic — Use where up to 1,000,000 gates and 24,576 logic elements are needed to implement customized control, protocol bridging, or interface logic.
• Multi‑I/O Interface Designs — Ideal for systems requiring many parallel I/Os (177 pins) for sensor arrays, peripheral aggregation, or multi-channel data routing.
• Low‑Power Commercial Systems — Suitable for commercial embedded products that benefit from flash-based configuration and the ProASIC3 family’s low-power characteristics.

Unique Advantages

• High Logic Density: 1,000,000 gates and 24,576 logic elements enable consolidation of multiple discrete functions into a single programmable device, reducing BOM complexity.
• Generous I/O Count: 177 user I/Os provide flexibility for multiple simultaneous interfaces without external multiplexing.
• On‑Chip Memory: Approximately 0.147 Mbits of embedded RAM supports localized buffering and state storage, simplifying board-level memory requirements.
• Compact Packaging: 256-LBGA (256-FPBGA, 17×17) minimizes PCB area while maintaining high signal density for space-constrained designs.
• Controlled Core Supply: Narrow core voltage range (1.425 V–1.575 V) assists in predictable power budgeting and stable device operation.
• Commercial‑Grade Thermal Range: Rated for 0 °C to 85 °C, suitable for standard commercial deployments and typical indoor operating conditions.

Why Choose M1A3P1000-1FG256?

The M1A3P1000-1FG256 positions itself as a compact, flash-configured FPGA option for commercial embedded designs that require substantial programmable logic, a high I/O count, and on-chip RAM in a space-efficient BGA package. Its specifications make it well-suited to engineers consolidating logic functions, implementing multi‑channel interfaces, or optimizing board-level integration.

Backed by the ProASIC3 family documentation from Microchip Technology, this device is a practical choice for projects where predictable core voltage, commercial temperature operation, and a flash-based configuration architecture are important selection criteria.

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