M1A3P1000-1FG144I

The M1A3P1000-1FG144I is a ProASIC3/EL family flash-based FPGA in a compact 144-LBGA package. It combines on-chip flash configuration and Flash*Freeze technology with a substantial logic and memory footprint to support industrial embedded designs.

This device targets industrial and defense-related markets that require moderate logic density, embedded RAM, and a controlled core-voltage operating range, while supporting extended temperature operation.

Key Features

• Logic Capacity — 24,576 logic elements (cells) providing up to 1,000,000 gates for mid-range FPGA designs.
• Embedded Memory — Approximately 0.147 Mbits of on-chip RAM (147,456 bits) to support buffering, FIFOs, and storage for application logic.
• I/O — 97 programmable I/O pins to interface with peripheral devices and external logic.
• Flash Configuration & Flash*Freeze Technology — Flash-based configuration for non-volatile programming and series-level Flash*Freeze capability as described in the ProASIC3/EL family documentation.
• Power — Core voltage supply range of 1.425 V to 1.575 V for defined power domain design and system integration.
• Package & Mounting — 144-LBGA package; supplier device package listed as 144-FPBGA (13×13). Surface-mount mounting type for PCB assembly.
• Operating Range — Industrial temperature rating from −40 °C to 100 °C for extended environment operation.
• Compliance — RoHS compliant to support regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control — Implement control logic, protocol bridging, and deterministic I/O handling where industrial temperature range and embedded memory are required.
• Communications Infrastructure — Support interface logic, buffering, and custom protocol implementation using available logic elements and on-chip RAM.
• Aerospace & Defense Systems — Use within systems where flash-based configuration and the ProASIC3/EL family features are specified (reference family datasheet for series capabilities).
• Test & Measurement — Implement data acquisition front-ends, preprocessing, and custom timing logic leveraging the device’s I/O count and embedded memory.

Unique Advantages

• Significant mid-range logic density: 24,576 logic elements and roughly 1,000,000 equivalent gates support complex glue logic and custom accelerators without moving to larger device families.
• On-chip RAM for data processing: Approximately 0.147 Mbits of embedded memory enables local buffering and state storage, reducing external memory dependence.
• Flash-based, non-volatile configuration: Built-in flash configuration and Flash*Freeze technology provide a stable, reprogrammable configuration approach suitable for field updates.
• Industrial temperature tolerance: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-variable environments.
• Compact BGA footprint: 144-LBGA (144-FPBGA 13×13) allows high-density board designs while maintaining ample I/O and logic resources.
• Controlled core-voltage spec: 1.425 V to 1.575 V supply range simplifies power-rail design and system integration.

Why Choose M1A3P1000-1FG144I?

The M1A3P1000-1FG144I positions itself as a flash-configured, industrial-grade FPGA option within the ProASIC3/EL family, offering a balance of logic density, embedded RAM, and a stable core-voltage specification. Its Flash*Freeze capability and flash-based configuration provide a non-volatile implementation path suitable for designs that require field programmability without external configuration memory.

This device is well suited for engineers and procurement teams building industrial, communications, aerospace, or measurement systems that need a mid-range FPGA in a compact BGA package, with defined temperature and power characteristics. Its feature set supports scalable designs while maintaining the supply and environmental parameters needed for long-term deployments.

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