M1A3P1000-1FG484

The M1A3P1000-1FG484 is a ProASIC3 flash-based FPGA from Microchip Technology, offering a mid-density logic fabric with on-chip embedded memory and a high I/O count. It implements ProASIC3 series architecture features including low-power operation with Flash*Freeze technology as described for the family.

With 24,576 logic elements, approximately 0.15 Mbits of embedded RAM and 300 user I/O pins in a compact 484-ball FPBGA (23 × 23) package, this device targets embedded designs that require flexible programmability, moderate logic capacity and a dense I/O footprint within a commercial temperature range.

Key Features

• Core Logic — 24,576 logic elements (cells) providing reprogrammable logic capacity for custom digital functions and glue logic.
• On‑chip Memory — 147,456 total RAM bits (approximately 0.15 Mbits) for FIFO buffering, small lookup tables and local storage.
• I/O Integration — 300 user I/O pins to support parallel interfaces, multi‑lane connectivity and dense board-level integration.
• Gate Count — 1,000,000 gates delivering ample combinational and sequential resource density for mid‑range designs.
• Low‑Power Technology — Family-level Flash*Freeze low‑power capability (ProASIC3 series) to reduce operational power when applicable.
• Power Rail — Single core voltage supply range of 1.425 V to 1.575 V for stable core operation.
• Package & Mounting — 484‑FPBGA (23 × 23) package, surface‑mount mounting type for high‑density PCB applications.
• Commercial Grade & Environmental — Commercial operating temperature 0 °C to 85 °C and RoHS compliant.

Typical Applications

• Embedded Control — Implement control logic and peripheral interfacing where moderate logic density and many I/Os are required.
• Connectivity & Protocol Bridging — Bridge between parallel and serial buses or translate protocols using the device's logic and available I/O resources.
• Signal Conditioning & Pre‑Processing — Perform front‑end digital filtering, aggregation or packet buffering using on‑chip RAM and logic elements.
• Custom I/O Expansion — Provide dense, configurable I/O expansion for systems needing flexible pin assignments and board‑level integration.

Unique Advantages

• Substantial Logic Capacity: 24,576 logic elements enable implementation of sizeable custom logic blocks and state machines without external CPLDs.
• High I/O Count: 300 user I/Os simplify board design by reducing the need for additional interface components.
• Integrated On‑Chip Memory: Approximately 0.15 Mbits of embedded RAM support buffering and temporary data storage close to the logic, improving latency and reducing external memory dependence.
• Compact, High‑Density Package: 484‑FPBGA (23 × 23) provides a small board footprint for space‑constrained designs while maintaining a large pin count.
• Controlled Core Voltage: Narrow supply range (1.425–1.575 V) supports consistent core performance across units.
• RoHS Compliant: Meets current lead‑free requirements for environmentally conscious designs.

Why Choose M1A3P1000-1FG484?

The M1A3P1000-1FG484 positions itself as a mid-density, flash-configurable FPGA that balances logic capacity, on‑chip memory and a high I/O count in a compact BGA package. Its specifications suit embedded system designers and OEMs who need configurable hardware resources and a dense pinout within a commercial temperature range.

Backed by Microchip Technology's ProASIC3 family architecture and the series' low‑power Flash*Freeze capability, this device is appropriate for projects that require reprogrammable logic, local buffering and significant I/O while maintaining compliance with RoHS and commercial temperature requirements.

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