M1A3P1000-1FGG144I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA |
|---|---|
| Quantity | 269 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M1A3P1000-1FGG144I – ProASIC3 Field Programmable Gate Array (FPGA) IC, 97 I/Os, 147,456 bits RAM, 144-LBGA
The M1A3P1000-1FGG144I is a reprogrammable, nonvolatile ProASIC3 family FPGA delivered in a 144-LBGA surface-mount package. It combines 24,576 logic elements with approximately 147,456 bits of embedded RAM and 97 user I/Os to address industrial embedded designs that require instant-on operation, low power consumption, and secure in-system programmability.
Designed for industrial use, this device supports solid mixed-voltage I/O flexibility, on-chip flash-based configuration, and a compact 144-FPBGA (13×13) footprint that fits two-layer and space-constrained PCBs.
Key Features
- Logic Capacity — 24,576 logic elements (cells) and 1,000,000 equivalent gates for mid-density logic integration.
- Embedded Memory — Approximately 147,456 bits of total RAM for user data, buffers, and FIFO implementations.
- Flexible I/O — 97 user I/Os with support for mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and bank-selectable I/O voltages as described in the ProASIC3 family documentation.
- Nonvolatile, Reprogrammable Flash — Flash-based configuration retains programmed design when powered off and enables reprogrammability and instant-on behavior as specified for the ProASIC3 series.
- Secure In-System Programming (ISP) — Supports AES-based secure ISP mechanisms as documented for the ProASIC3 family for protecting configuration data during JTAG programming.
- Power and Supply — Core supply specified at 1.425 V to 1.575 V to support low-power system architectures.
- Package and Mounting — 144-LBGA, supplier device package 144-FPBGA (13×13); surface-mount mounting type suitable for compact board layouts.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial applications.
- Standards and Compliance — RoHS-compliant device and supports JTAG boundary-scan as per the ProASIC3 family documentation.
Typical Applications
- Industrial Control and Automation — Mid-density logic and industrial temperature rating make the device suitable for control logic, I/O aggregation, and protocol bridging in industrial systems.
- Secure Embedded Systems — On-chip flash and AES-based in-system programming support protected configuration updates and secure deployment scenarios.
- Portable and Battery-Powered Devices — Low core-voltage operation and flash-based instant-on behavior suit power-constrained portable equipment.
- Mixed-Voltage Interface Hubs — Bank-selectable I/O voltages and 97 I/Os allow the device to interface between multiple voltage domains and peripheral buses.
Unique Advantages
- Reprogrammable Nonvolatile Configuration — Flash-based configuration retains designs without external configuration memory, simplifying system BOM and boot behavior.
- Balanced Logic and Memory — 24,576 logic elements combined with approximately 147,456 bits of RAM provide a mid-density platform for integrated control, buffering, and data-path functions.
- Secure Field Updates — AES-capable in-system programming provides a mechanism for authenticated configuration changes in the field.
- Compact Industrial Packaging — 144-LBGA (13×13) package supports space-constrained board designs while meeting industrial temperature requirements.
- Flexible I/O Support — Mixed-voltage I/O capability and nearly 100 user I/Os enable versatile peripheral interfacing without level-shifter complexity.
Why Choose M1A3P1000-1FGG144I?
The M1A3P1000-1FGG144I positions itself as a mid-density, industrial-grade FPGA that balances programmable logic capacity, embedded RAM, and flexible I/O in a compact LBGA package. Its flash-based nonvolatile configuration and AES-capable in-system programming make it a practical choice where secure, instant-on behavior and field reprogrammability are required.
Engineers designing industrial control, secure embedded systems, or compact mixed-voltage interfaces will find this device offers a practical combination of integration, temperature robustness, and on-chip memory to reduce external components and simplify board design.
Request a quote or submit a purchase inquiry today to evaluate how the M1A3P1000-1FGG144I can meet your mid-density FPGA requirements in industrial applications.

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