M1A3P1000-1FGG144I

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA

Quantity 269 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M1A3P1000-1FGG144I – ProASIC3 Field Programmable Gate Array (FPGA) IC, 97 I/Os, 147,456 bits RAM, 144-LBGA

The M1A3P1000-1FGG144I is a reprogrammable, nonvolatile ProASIC3 family FPGA delivered in a 144-LBGA surface-mount package. It combines 24,576 logic elements with approximately 147,456 bits of embedded RAM and 97 user I/Os to address industrial embedded designs that require instant-on operation, low power consumption, and secure in-system programmability.

Designed for industrial use, this device supports solid mixed-voltage I/O flexibility, on-chip flash-based configuration, and a compact 144-FPBGA (13×13) footprint that fits two-layer and space-constrained PCBs.

Key Features

  • Logic Capacity — 24,576 logic elements (cells) and 1,000,000 equivalent gates for mid-density logic integration.
  • Embedded Memory — Approximately 147,456 bits of total RAM for user data, buffers, and FIFO implementations.
  • Flexible I/O — 97 user I/Os with support for mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and bank-selectable I/O voltages as described in the ProASIC3 family documentation.
  • Nonvolatile, Reprogrammable Flash — Flash-based configuration retains programmed design when powered off and enables reprogrammability and instant-on behavior as specified for the ProASIC3 series.
  • Secure In-System Programming (ISP) — Supports AES-based secure ISP mechanisms as documented for the ProASIC3 family for protecting configuration data during JTAG programming.
  • Power and Supply — Core supply specified at 1.425 V to 1.575 V to support low-power system architectures.
  • Package and Mounting — 144-LBGA, supplier device package 144-FPBGA (13×13); surface-mount mounting type suitable for compact board layouts.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial applications.
  • Standards and Compliance — RoHS-compliant device and supports JTAG boundary-scan as per the ProASIC3 family documentation.

Typical Applications

  • Industrial Control and Automation — Mid-density logic and industrial temperature rating make the device suitable for control logic, I/O aggregation, and protocol bridging in industrial systems.
  • Secure Embedded Systems — On-chip flash and AES-based in-system programming support protected configuration updates and secure deployment scenarios.
  • Portable and Battery-Powered Devices — Low core-voltage operation and flash-based instant-on behavior suit power-constrained portable equipment.
  • Mixed-Voltage Interface Hubs — Bank-selectable I/O voltages and 97 I/Os allow the device to interface between multiple voltage domains and peripheral buses.

Unique Advantages

  • Reprogrammable Nonvolatile Configuration — Flash-based configuration retains designs without external configuration memory, simplifying system BOM and boot behavior.
  • Balanced Logic and Memory — 24,576 logic elements combined with approximately 147,456 bits of RAM provide a mid-density platform for integrated control, buffering, and data-path functions.
  • Secure Field Updates — AES-capable in-system programming provides a mechanism for authenticated configuration changes in the field.
  • Compact Industrial Packaging — 144-LBGA (13×13) package supports space-constrained board designs while meeting industrial temperature requirements.
  • Flexible I/O Support — Mixed-voltage I/O capability and nearly 100 user I/Os enable versatile peripheral interfacing without level-shifter complexity.

Why Choose M1A3P1000-1FGG144I?

The M1A3P1000-1FGG144I positions itself as a mid-density, industrial-grade FPGA that balances programmable logic capacity, embedded RAM, and flexible I/O in a compact LBGA package. Its flash-based nonvolatile configuration and AES-capable in-system programming make it a practical choice where secure, instant-on behavior and field reprogrammability are required.

Engineers designing industrial control, secure embedded systems, or compact mixed-voltage interfaces will find this device offers a practical combination of integration, temperature robustness, and on-chip memory to reduce external components and simplify board design.

Request a quote or submit a purchase inquiry today to evaluate how the M1A3P1000-1FGG144I can meet your mid-density FPGA requirements in industrial applications.

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