M1A3P1000-1FGG256I

The M1A3P1000-1FGG256I is a reprogrammable, nonvolatile ProASIC3 FPGA that delivers secure, low-power, instant-on operation in a single-chip solution. It combines a high logic density core with substantial embedded RAM and a large I/O count to address designs where performance, flexibility and compact integration are important.

Targeted at industrial and embedded applications, this device supports a broad operating voltage and temperature range and is offered in a compact 256-LBGA package for space-constrained PCBs.

Key Features

• FPGA Core (Flash-Based) Reprogrammable flash-based FPGA architecture with nonvolatile configuration and instant-on capability; retains programmed design when powered off.
• Logic Capacity Approximately 24,576 logic elements (LEs) to implement complex digital functions and control logic.
• Embedded Memory Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for buffers, FIFOs and small data structures; includes true dual-port SRAM organization in the family architecture.
• I/O and Mixed-Voltage Support 177 user I/Os with support for mixed I/O voltages across banks, enabling flexible interfacing to 1.5V, 1.8V, 2.5V and 3.3V domains.
• Power Low-voltage core operation with a supply range of 1.425 V to 1.575 V, supporting low-power system designs.
• Security and In-System Programming Supports in-system programming with on-chip AES 128-bit decryption and FlashLock security features for protected bitstreams.
• Clocking and Timing Integrated clock conditioning capabilities including multiple CCC blocks and PLL support for configurable phase shift, multiply/divide and delay functions.
• Package and Mounting 256-LBGA (256-FPBGA, 17×17) surface-mount package suitable for compact board designs; device is RoHS compliant and specified for industrial-grade operation.
• Environmental Range Rated for operation from −40 °C to 100 °C, supporting deployment in industrial temperature environments.

Typical Applications

• Portable and Battery-Backed Devices — Instant-on, low-power operation and nonvolatile configuration make the device suitable for portable electronics and battery-backed systems.
• Consumer Electronics — High I/O count and mixed-voltage support enable interface-rich consumer applications that require compact FPGA integration.
• Industrial Control and Instrumentation — Industrial temperature rating and robust I/O options support automation, control logic and sensor aggregation in industrial systems.
• Secure In-System Programmable Designs — On-chip AES decryption and FlashLock features provide a foundation for secure firmware and bitstream management in field-updatable products.

Unique Advantages

• Nonvolatile, Instant-On Operation: Flash-based configuration retains the programmed design without external memory and enables immediate startup.
• High Logic Density: 24,576 logic elements provide substantial capacity for mid-density digital designs without external logic ICs.
• Large I/O Count: 177 user I/Os simplify connectivity to peripherals, sensors and external devices while supporting mixed-voltage banks.
• Significant Embedded RAM: Approximately 0.147 Mbits of on-chip RAM supports buffering and local data storage to reduce external memory needs.
• Low-Voltage, Low-Power Core: Core supply from 1.425 V to 1.575 V enables efficient power budgets in modern embedded systems.
• Industrial Temperature Range and RoHS Compliance: −40 °C to 100 °C rating and RoHS status support deployment in industrial environments and compliance-driven designs.
• Secure ISP Capability: On-chip AES 128-bit ISP and FlashLock allow secure in-field updates and protected bitstreams.
• Compact Ball Grid Package: 256-LBGA (17×17) minimizes PCB area for high-density layouts.

Why Choose M1A3P1000-1FGG256I?

The M1A3P1000-1FGG256I combines substantial programmable logic, a high I/O count and embedded RAM with nonvolatile flash configuration and built-in security features. Its low-voltage core, industrial temperature rating and compact 256-LBGA package make it a practical choice for embedded and industrial designs that require instant-on behavior, secure in-system programmability and flexible interfacing.

This device is well suited for engineers and teams building mid-density FPGA solutions where integration, reliable operation across temperature extremes and field update capability provide long-term design value.

Request a quote or contact our sales team to discuss availability, lead times and volume pricing for M1A3P1000-1FGG256I.