M1A3P1000-1PQ208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP |
|---|---|
| Quantity | 349 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 154 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M1A3P1000-1PQ208I – ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP
The M1A3P1000-1PQ208I is a Microchip Technology ProASIC3 field programmable gate array (FPGA) supplied in a 208-pin QFP package for surface-mount assembly. It delivers a combination of logic capacity, embedded memory and I/O density targeted for industrial embedded designs that require reprogrammable logic and compact board-level integration.
With industrial grade operating range and controlled power requirements, this device is suited for designs that need reliable operation across extended temperature ranges and precise supply voltages.
Key Features
- Core Logic – 24,576 logic elements providing up to 1,000,000 gates of user-configurable logic for implementing custom digital functions.
- Embedded Memory – 147,456 bits of on-chip RAM (approximately 0.147 Mbits) to support buffering, state storage and data handling within the FPGA fabric.
- I/O Capacity – 154 user I/O pins to interface with peripherals, sensors and external logic on industrial control and embedded systems.
- Power Supply – Device supply voltage range specified at 1.425 V to 1.575 V to support stable core operation within defined limits.
- Package & Mounting – 208-pin BFQFP package (supplier device package listed as 208‑PQFP, 28×28) for surface-mount PCB assembly.
- Operating Temperature – Rated for −40 °C to 100 °C to meet industrial thermal requirements.
- Compliance – RoHS compliant to support environmental and regulatory considerations in product design.
- Mounting Type – Surface mount for automated PCB assembly and standard manufacturing processes.
Typical Applications
- Industrial Automation – Implement control logic, I/O aggregation and custom timing functions in factory and process automation equipment.
- Embedded Control Systems – Provide reprogrammable logic and local buffering for embedded controllers, instrumentation and interface modules.
- Communications & I/O Bridging – Serve as protocol adapters or I/O expansion devices where a moderate number of pins and internal memory are required.
Unique Advantages
- High logic capacity: 24,576 logic elements and 1,000,000 gates allow implementation of complex custom logic without external ASICs.
- Integrated on-chip memory: 147,456 bits of RAM reduce the need for external memory in many buffering and state-management tasks.
- Robust industrial temperature range: Rated from −40 °C to 100 °C for dependable operation in extended-temperature deployments.
- Compact QFP package: 208-pin BFQFP/208‑PQFP (28×28) supports dense layouts while remaining compatible with surface-mount assembly processes.
- Controlled core power: Narrow supply window (1.425 V–1.575 V) simplifies power budgeting and helps maintain stable core performance.
- Regulatory readiness: RoHS compliance simplifies environmental qualification for commercial and industrial products.
Why Choose M1A3P1000-1PQ208I?
The M1A3P1000-1PQ208I positions itself as a practical FPGA choice for designers needing substantial programmable logic, embedded RAM and a generous I/O count in a surface-mount QFP package. Its industrial operating range and RoHS compliance make it appropriate for long-life embedded applications where temperature resilience and regulatory considerations matter.
This device is well suited to teams building mid-density, reprogrammable logic solutions that benefit from on-chip memory and a compact 208-pin package, offering a balance of integration and predictable power/temperature characteristics.
Request a quote or submit an inquiry to receive pricing and availability for the M1A3P1000-1PQ208I and discuss your quantity or evaluation needs.

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