M1A3P1000-1PQG208M

The M1A3P1000-1PQG208M is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology, supplied in a 208-BFQFP package. It delivers a high-density programmable fabric with 24,576 logic elements (approximately 1,000,000 gates) and embedded RAM totaling 147,456 bits, together with 154 general-purpose I/O pins.

Designed and qualified for military use under MIL-STD-883 and specified for operation from -55 °C to 125 °C, this device addresses applications that require reliable, reconfigurable logic in demanding thermal and qualification environments while operating from a 1.425 V to 1.575 V supply.

Key Features

• Core Logic  24,576 logic elements (equivalent to 1,000,000 gates) provide a high-density programmable fabric for complex digital designs.
• Embedded Memory  147,456 bits of on-chip RAM (approximately 0.147 Mbits) for local buffering, state storage, and small lookup tables.
• I/O Capacity  154 I/O pins support broad external connectivity for peripherals, sensors, and board-level interfacing.
• Package and Mounting  208-BFQFP package (supplier notation: 208-PQFP (28x28)) in a surface-mount form factor for PCB assembly.
• Voltage Supply  Operates from a tightly specified core supply of 1.425 V to 1.575 V for consistent performance.
• Rugged Qualification  Military grade with MIL-STD-883 qualification and an operating temperature range of -55 °C to 125 °C for demanding environments.
• Compliance  RoHS-compliant device meeting environmental regulatory requirements.

Typical Applications

• Defense and Aerospace Electronics  Military-grade qualification and wide operating temperature range make this FPGA suitable for defense and aerospace control and processing modules.
• Rugged Embedded Systems  Use in embedded controllers and mission-critical systems that require reconfigurable logic and operation across extreme temperatures.
• High-Reliability Avionics  Deployed where MIL-STD-883 qualification and tight supply and thermal specifications are required for dependable performance.

Unique Advantages

• High Logic Density: 24,576 logic elements and 1,000,000 gates enable implementation of complex digital functions in a single device, reducing board-level component count.
• Integrated On-Chip Memory: Approximately 0.147 Mbits of embedded RAM supports local data buffering and state storage without external memory.
• Extensive I/O: 154 I/O pins provide flexible interfacing options for sensors, buses, and peripheral devices.
• Military Qualification: MIL-STD-883 qualification and a -55 °C to 125 °C operating range deliver traceable robustness for defense applications.
• Surface-Mount Package: 208-BFQFP (208-PQFP (28x28)) surface-mount package simplifies PCB integration in compact layouts.
• Regulatory Compliance: RoHS compliance supports environmental and regulatory requirements for modern electronic assemblies.

Why Choose M1A3P1000-1PQG208M?

The M1A3P1000-1PQG208M combines substantial programmable logic capacity, on-chip memory, and a high I/O count in a military-qualified FPGA. Its temperature range and MIL-STD-883 qualification make it suitable for designs that demand reconfigurability alongside verified reliability in harsh environments.

This device is well suited for engineers and programs requiring a scalable, rugged FPGA building block—delivering integration that can reduce board-level complexity while meeting strict qualification and thermal demands.

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