M1A3P1000-1PQG208I

The M1A3P1000-1PQG208I is a Microchip Technology ProASIC3 flash-based FPGA in a 208-pin BFQFP package designed for industrial applications. It delivers a high-density, nonvolatile programmable fabric with 24,576 logic elements and 147,456 bits of embedded RAM, making it suitable for embedded control, communications, and industrial automation designs that require robust I/O and on-board configuration retention.

With a 1.425–1.575 V core supply range, support for surface-mount 208-PQFP (28×28) packaging, and an operating temperature range of −40 °C to 100 °C, this device is built for reliable operation in temperature-critical and industrial environments.

Key Features

• Core Capacity — Approximately 1,000,000 gates realized through 24,576 logic elements (LEs) to implement complex logic and control functions.
• Embedded Memory — 147,456 bits of on-chip RAM to support FIFOs, buffers, and small lookup tables without external memory.
• High I/O Count — 154 user I/Os to interface with multiple sensors, peripherals, buses, and external devices.
• Nonvolatile, Flash-Based Fabric — Flash-based architecture retains programmed designs when powered off and supports in-system reprogramming.
• Power Supply — Core supply range of 1.425 V to 1.575 V optimized for low-voltage systems.
• Package & Mounting — Surface-mount 208-BFQFP / 208-PQFP (28×28) package for board-level integration on two-layer and multi-layer PCBs.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for demanding environmental conditions.
• Standards & Compliance — RoHS-compliant manufacturing to meet common environmental and regulatory requirements.

Typical Applications

• Industrial Control — Implement machine control logic, I/O aggregation, and protocol bridging where robust I/O and industrial temperature operation are required.
• Communications & Networking — Use as packet processing logic, protocol conversion, or custom interface glue with high I/O density and embedded RAM for buffering.
• Embedded Systems — Integrate custom state machines, peripheral controllers, and timing logic in compact, single-chip deployments.
• Consumer & Portable Devices — Flash-based, nonvolatile configuration and low-voltage core make it suitable for power-sensitive and battery-backed systems.

Unique Advantages

• Nonvolatile, Reprogrammable Architecture: Flash-based configuration retains designs without external configuration memory and supports in-system updates.
• High Logic Density: 24,576 logic elements provide substantial implementation capacity while keeping board footprint consolidated.
• Generous On-Chip RAM: 147,456 bits of embedded RAM reduce dependence on external memory for buffering and small state storage.
• Extensive I/O: 154 user I/Os enable multiple peripheral interfaces and flexible board-level connectivity.
• Industrial Reliability: −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial and regulated environments.
• Board-Level Friendly Package: 208-pin BFQFP (28×28) surface-mount package offers a balance between pin count and PCB routing simplicity.

Why Choose M1A3P1000-1PQG208I?

The M1A3P1000-1PQG208I combines flash-based, nonvolatile FPGA flexibility with industrial-grade operating conditions and a high I/O count. Its balance of logic density, embedded RAM, and robust packaging makes it well suited for engineers building embedded control, communications, and industrial systems that need retained configuration, significant on-chip resources, and reliable temperature performance.

Choosing this Microchip ProASIC3 device supports compact BOMs and simplified board architectures by consolidating logic, memory buffers, and extensive I/O into a single surface-mount IC backed by RoHS-compliant manufacturing.

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