M1A3P1000-2FG256

The M1A3P1000-2FG256 is a ProASIC3 flash-based Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a mid-range programmable fabric with 24,576 logic elements and on-chip flash memory architecture suitable for embedded control, glue logic and interface functions.

Designed for surface-mount assembly in a 256-LBGA package, this device combines a defined core voltage range and commercial temperature rating to serve applications that require a balance of logic capacity, I/O density and compact packaging.

Key Features

• Core / Logic Capacity Approximately 24,576 logic elements (24576 logic elements) and an internal equivalent of 1,000,000 gates for mid-range programmable logic implementations.
• Embedded Memory Total on-chip RAM of 147,456 bits — approximately 0.147 Mbits of embedded memory for local buffering and small data structures.
• I/O Density 177 user I/O pins to support multiple signals, interfaces and board-level interconnect requirements.
• Flash-Based Technology Part of the ProASIC3 family (flash-based FPGA architecture) as documented in the ProASIC3/EL datasheet; family references include Flash*Freeze technology.
• Power and Supply Core voltage supply range of 1.425 V to 1.575 V, enabling defined low-voltage operation for the programmable fabric.
• Package & Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17×17) and surface-mount mounting type for compact PCB implementations.
• Operating Range & Grade Commercial grade with operating temperature from 0 °C to 85 °C.
• Regulatory / Environmental RoHS compliant.

Typical Applications

• Aerospace & Defense systems ProASIC3 flash architecture and the device's logic and I/O capacity support control and interface functions commonly used in aerospace and defense electronics.
• Communications equipment With 177 I/Os and mid-range logic resources, the device suits protocol bridging, interface control and timing logic within communications hardware.
• Industrial control The combination of on-chip RAM and 24,576 logic elements supports embedded control, deterministic glue logic and local data handling in industrial applications.
• Data center and networking modules Compact 256-LBGA packaging and defined supply voltage make the device appropriate for dense module designs requiring programmable logic and I/O integration.

Unique Advantages

• Balanced logic and memory capacity 24,576 logic elements paired with 147,456 bits of on-chip RAM offer a practical balance for mid-range programmable tasks without excess overhead.
• High I/O count in a compact package 177 I/Os in a 256-LBGA (17×17 FPBGA) deliver routing flexibility while minimizing board area.
• Predictable core supply Narrow core voltage range (1.425–1.575 V) simplifies power-supply design and verification for the programmable fabric.
• Surface-mount readiness Designed for surface-mount assembly to fit modern automated PCB manufacturing flows.
• RoHS compliant Meets RoHS requirements to support environmental compliance objectives.
• Commercial temperature suitability Rated 0 °C to 85 °C for a wide range of non-automotive, non-military commercial applications.

Why Choose M1A3P1000-2FG256?

The M1A3P1000-2FG256 delivers a practical mid-range FPGA solution: ample logic resources (24,576 logic elements), a substantial I/O count (177 pins) and on-chip RAM (approximately 0.147 Mbits) in a compact 256-LBGA package. Its flash-based ProASIC3 architecture provides designers with a stable, non-volatile configuration approach as described in the ProASIC3/EL family documentation.

This device is well suited to engineers and purchasing teams who need a programmable solution that balances integration, board-area efficiency and defined electrical and thermal operating windows. Its specification set supports scalable designs where predictable supply and commercial temperature operation are required.

Request a quote or submit a pricing inquiry for M1A3P1000-2FG256 today to learn more about availability and ordering options.