M1A3P1000-2FG256I

The M1A3P1000-2FG256I is a ProASIC3 family Field Programmable Gate Array (FPGA) offered in a 256-LBGA package. It provides a flash-based FPGA architecture with a high logic element count, ample embedded RAM and a broad I/O complement suitable for industrial embedded designs.

Targeted at industrial applications, this device combines 24,576 logic elements, approximately 147,456 bits of on-chip RAM, and 177 I/O pins in a surface-mount 256-FPBGA (17×17) package, operating across a 1.425 V–1.575 V core supply and an ambient range of −40 °C to 100 °C.

Key Features

• Logic Density  24,576 logic elements (cells) delivering up to 1,000,000 gates of programmable logic for medium-density FPGA designs.
• Embedded Memory  147,456 bits of total on-chip RAM (approximately 0.147 Mbits) for temporary storage, buffering and scratchpad memory.
• I/O Capacity  177 general-purpose I/O pins to support multiple interfaces and external peripherals.
• Flash-Based Architecture  Part of the ProASIC3 family of low-power flash FPGAs; family documentation references Flash*Freeze technology for low-power retention modes.
• Power Supply  Core operating voltage range of 1.425 V to 1.575 V to match system power domains precisely.
• Package and Mounting  Surface-mount 256-LBGA package; supplier device package listed as 256-FPBGA (17×17) for compact board-level integration.
• Industrial Temperature  Qualified for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Implement control logic, protocol bridging and sequencing functions using the device’s abundant logic elements and I/O resources.
• Communications Equipment  Use the FPGA’s programmable fabric and on-chip RAM for custom packet processing, interface adaptation and buffering.
• Test & Measurement  Create deterministic timing engines, data acquisition front-ends and signal routing logic leveraging the device’s logic density and IO count.
• Embedded Processing and Peripherals  Integrate peripheral controllers, glue logic and customized accelerators where compact package size and industrial temperature range are required.

Unique Advantages

• High Logic Capacity: 24,576 logic elements and 1,000,000 gates provide the resources needed for complex, integrated designs without external glue logic.
• Significant On‑Chip Memory: Approximately 147,456 bits of embedded RAM supports buffering and local storage, reducing external memory dependencies.
• Large I/O Count: 177 I/O pins enable multiple parallel interfaces and flexible board-level routing options.
• Compact, Surface‑Mount Package: 256-LBGA / 256-FPBGA (17×17) package balances board density with thermal and routing considerations.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation to support deployments in harsh environments.
• Flash-Based, Low-Power Family Features: ProASIC3 family characteristics include flash-based configuration and documented Flash*Freeze technology for low-power retention modes.
• Regulatory Compliance: RoHS compliant for streamlined environmental qualification.

Why Choose M1A3P1000-2FG256I?

The M1A3P1000-2FG256I positions itself as a robust industrial-grade FPGA option that brings together substantial logic density, embedded memory and a large I/O count in a compact 256-LBGA footprint. Its specified operating voltage and wide temperature range make it suitable for applications that require stable, long-term operation in industrial environments.

Designers seeking a flash-based programmable device with on-chip RAM and extensive I/O capability will find this part appropriate for medium-complexity FPGA functions where board space, thermal profile and environmental tolerance are important. RoHS compliance and the ProASIC3 family feature set support integration into regulated, production-grade systems.

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