M1A3P1000-2FGG144

The M1A3P1000-2FGG144 is a ProASIC3 family field programmable gate array (FPGA) featuring 24,576 logic elements and 97 user I/Os in a 144-LBGA package. This reprogrammable, nonvolatile flash-based FPGA is designed for low-power, instant-on applications where performance, integration and security are important.

Targeted at consumer, portable and battery-backed markets, the device combines on-chip embedded memory and flexible I/O to simplify system design while supporting mixed-voltage interfaces and in-system programming.

Key Features

• Core & Logic — 24,576 logic elements (cells) and a reported 1,000,000 equivalent system gates provide dense logic capacity for complex designs.
• Embedded Memory — 147,456 total RAM bits of on-chip memory (approximately 0.147 Mbits) plus on-chip Flash ROM for user nonvolatile storage.
• I/O Flexibility — 97 user I/Os with support for mixed-voltage operation across I/O banks, suitable for interfacing to 1.5V, 1.8V, 2.5V and 3.3V domains as indicated in the series datasheet.
• Security & In-System Programming — Series-level support for in-system programming with on-chip AES decryption and FlashLock to protect programmed contents.
• Performance — Series-level system performance characteristics include up to 350 MHz operation and segmented, hierarchical routing and clock structures for efficient timing.
• Power & Voltage — Core supply range of 1.425 V to 1.575 V and low-power architecture suited to power-sensitive designs.
• Package & Mounting — Surface-mount 144-LBGA (supplier device package 144-FPBGA, 13×13) for compact board integration and two-layer PCB friendliness.
• Operating Range & Compliance — Commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Portable Consumer Electronics — Instant-on, low-power FPGA functionality for user interfaces, peripheral control and feature-rich consumer devices.
• Battery-backed Systems — Flash-based nonvolatile programmability and low core voltage make the device suitable for battery-powered equipment requiring retained configuration.
• High-volume, Cost-sensitive Products — Small-footprint 144-LBGA package and two-layer PCB compatibility support compact, high-volume designs.
• Interface and Glue Logic — Flexible mixed-voltage I/Os and abundant logic elements for protocol bridging, I/O aggregation and custom peripheral interfaces.

Unique Advantages

• Nonvolatile, Reprogrammable Solution: Flash-based architecture retains programmed design when powered off and supports in-system updates.
• High Logic Density: 24,576 logic elements enable implementation of complex control, glue logic and moderate signal-processing tasks on a single chip.
• Flexible I/O and Mixed-Voltage Support: A large number of user I/Os and bank-selectable voltages simplify integration with diverse external peripherals.
• Security and IP Protection: On-chip AES decryption and FlashLock features (series-level) support secure configuration and IP protection strategies.
• Compact, Surface-Mount Package: 144-LBGA (144-FPBGA 13×13) provides a small PCB footprint for space-constrained designs.
• Commercial Temperature Grade: Rated for 0 °C to 85 °C operation to match a wide range of commercial applications.

Why Choose M1A3P1000-2FGG144?

The M1A3P1000-2FGG144 delivers a balanced combination of logic capacity, embedded memory and flexible I/O in a compact 144-LBGA package. Its flash-based, reprogrammable architecture with on-chip nonvolatile storage supports instant-on behavior and in-field updates, while series-level security features help protect design IP.

This device is well suited for designers building cost- and power-sensitive consumer, portable, or battery-backed products that require a single-chip FPGA solution with substantial logic density and mixed-voltage interfacing.

Request a quote or submit a product inquiry to evaluate M1A3P1000-2FGG144 for your next design and to obtain pricing and availability information.