M1A3P1000-2FGG484

The M1A3P1000-2FGG484 is a ProASIC3 family FPGA offering a high-density, flash-based reprogrammable fabric in a 484-ball BGA package. Designed for applications that require a balance of logic capacity, on-chip memory, and extensive I/O, this device targets portable and high-volume consumer designs as well as low-power embedded systems.

This surface-mount device integrates approximately 24,576 logic elements and 147,456 bits of embedded memory, with up to 300 user I/Os, delivering a compact single-chip solution for instant-on, secure, and power-conscious designs.

Key Features

• Core Logic  Approximately 24,576 logic elements (logic element cells) supporting a system gate equivalent of about 1,000,000 gates for mid-range FPGA integration.
• Embedded Memory  Total on-chip RAM of 147,456 bits — approximately 0.147 Mbits of embedded memory for SRAM and FIFO structures.
• I/O Capacity & Flexibility  Up to 300 user I/Os with support for mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and bank-selectable I/O voltages to interface with a wide range of peripherals and subsystems.
• Programming & Security (Series Features)  Flash-based reprogrammable technology with in-system programming via JTAG and on-chip AES decryption for secured configuration and content protection.
• Power  Core supply range specified at 1.425 V to 1.575 V, enabling low-voltage operation consistent with 1.5V core architectures for reduced power consumption.
• Package & Mounting  484-FPBGA (23 × 23) package, surface-mount mounting type, optimized for compact PCB layouts and high-density board integration.
• Operating Environment & Compliance  Commercial-grade operating temperature from 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

• Portable Consumer Electronics  Use for instant-on control, user interfaces, and peripheral aggregation where low power and compact packaging are important.
• Battery-Powered Systems  Suitable for designs that need flash-based nonvolatility and low core-voltage operation to extend battery life.
• Secure Embedded Solutions  Applies to products requiring in-system programming with hardware AES decryption and FlashLock-style protection to secure bitstreams.
• High-Density I/O Control  Ideal for applications that require many external interfaces—sensor hubs, display controllers, or I/O concentrators—leveraging up to 300 user I/Os.

Unique Advantages

• Reprogrammable Flash-Based Design:  Retains programmed configuration when powered off, enabling instant-on behavior and flexible field updates without external memory.
• High I/O Count in a Compact Package:  300 available I/Os in a 484-BGA footprint helps reduce board-level complexity and connector count for dense system designs.
• Low-Voltage Core Operation:  Specified core supply of 1.425 V to 1.575 V supports energy-efficient designs and compatibility with 1.5V-only systems.
• Integrated Security & ISP:  On-chip AES decryption and secure programming workflows enable protected configuration and secure in-field updates.
• Commercial Temperature Range & RoHS Compliance:  Commercial-grade temperature rating (0 °C to 85 °C) and RoHS compliance streamline deployment in consumer and commercial products.

Why Choose M1A3P1000-2FGG484?

The M1A3P1000-2FGG484 combines substantial logic capacity and embedded memory with a high I/O count in a compact 484-BGA package, offering a practical balance of performance, integration, and power efficiency for commercial embedded designs. Its flash-based reprogrammability and on-chip security features support flexible development cycles and secure deployment.

Choose this ProASIC3 FPGA when your design requires a single-chip, reprogrammable solution with broad I/O capability, low-voltage core operation, and RoHS compliance—well suited for consumer, portable, and other commercial applications where board space and power matter.

Request a quote or submit an inquiry to receive pricing and availability for the M1A3P1000-2FGG484 and to discuss how it can fit your next design.