M1A3P1000-2PQ208I

The M1A3P1000-2PQ208I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology, offered in a 208‑pin BFQFP package. It delivers a balanced combination of programmable logic, embedded memory and I/O capacity for industrial and defense-oriented applications that require surface-mount packaging, a wide operating temperature range and low-voltage core operation.

As part of the Military ProASIC3/EL family (datasheet reference), this device is associated with family-level features such as Flash*Freeze Technology and is positioned for use where reliable reprogrammable logic and defined operating parameters are required.

Key Features

• Core Logic — 24,576 logic elements providing approximately 1,000,000 gates for implementing custom digital logic and control functions.
• Embedded Memory — Approximately 0.147 Mbits of on-chip RAM (147,456 total RAM bits) to support buffering, state machines and small data stores.
• I/O Capacity — 154 user I/O pins to interface with peripherals, sensors and board-level buses.
• Power / Voltage — Core supply range specified at 1.425 V to 1.575 V for predictable power planning and supply design.
• Package & Mounting — 208‑BFQFP (supplier device package: 208‑PQFP, 28×28 mm) in a surface-mount form factor for compact PCB integration.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in harsh or outdoor environments.
• Environmental Compliance — RoHS compliant.
• Family-Level Technology — Identified with the Military ProASIC3/EL family (datasheet reference) which documents Flash*Freeze Technology for the series.

Typical Applications

• Aerospace & Defense Systems — Implement control logic, I/O bridging and custom interfaces where defined industrial and military family characteristics are required.
• Industrial Automation — Motor control, sensor aggregation and machine I/O functions leveraging wide temperature operation and high I/O count.
• Communications Equipment — Protocol bridging, timing logic and peripheral management in rack-mounted or embedded communications platforms.
• Data Center & Storage Subsystems — Board-level control, interface adaptation and glue logic in storage and networking equipment.

Unique Advantages

• High logic density: 24,576 logic elements and roughly 1,000,000 gates enable complex control and data-path implementations without external CPLDs.
• Embedded memory for local buffering: Approximately 0.147 Mbits of on-chip RAM reduces dependence on external memory for small buffers and state storage.
• Robust industrial temperature range: Rated from −40 °C to 100 °C to support deployments in challenging environmental conditions.
• Flexible I/O support: 154 I/O pins allow direct interfacing to a broad set of peripherals and sensors, simplifying PCB routing and design.
• Compact surface-mount package: 208‑pin BFQFP (28×28 PQFP) offers a space-efficient footprint for dense board designs.
• Regulatory alignment: RoHS compliance aids integration into designs requiring lead-free components.

Why Choose M1A3P1000-2PQ208I?

The M1A3P1000-2PQ208I delivers a practical balance of programmable logic capacity, embedded memory and I/O density in a compact, surface-mount 208‑pin package. With an industrial temperature rating and a narrow core voltage specification, it supports stable, repeatable integration into demanding embedded, communications and defense-oriented systems.

This device is well suited for design teams that need moderate-to-high logic resources, local RAM for buffering, and a high number of I/Os in a package compatible with standard PCB assembly processes. Its alignment with the Military ProASIC3/EL family provides access to family-level documentation (datasheet) and established device characteristics from Microchip Technology.

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