M1A3P1000-2FG484I

The M1A3P1000-2FG484I is a ProASIC3 field programmable gate array designed for industrial embedded systems requiring reprogrammable logic and a high pin-count interface. This flash-based FPGA integrates a large logic resource set and on-chip RAM, making it suitable for custom control, I/O aggregation, and mid-density signal-processing tasks within industrial applications.

Key Features

• Core Logic – 24,576 logic elements (cells) providing substantial configurable logic capacity for implementing custom digital functions; indicated device gate count is 1,000,000.
• Embedded Memory – 147,456 total RAM bits of on-chip memory (approximately 0.147 Mbits) for FIFOs, buffers, and small data stores.
• I/O Capacity – 300 user I/O pins to support dense peripheral, sensor, and interface connectivity.
• Flash-Based Architecture – Part of the ProASIC3 family featuring flash configuration technology; datasheet references Flash*Freeze technology for low-power operation in the series.
• Power – Single core supply range of 1.425 V to 1.575 V to match modern low-voltage system rails.
• Package & Mounting – 484-ball BGA in a 23 × 23 FPBGA footprint (484-FPBGA), surface-mount package suited for high-pin-count board designs.
• Industrial Temperature Range – Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Environmental Compliance – RoHS compliant.

Typical Applications

• Industrial Control – Implement custom state machines, motor-control interfaces, and deterministic logic for factory automation and process control systems.
• I/O Aggregation – Consolidate multiple sensor and actuator interfaces with 300 available I/Os for compact, high-density embedded systems.
• Embedded Signal Processing – Use the combination of logic elements and on-chip RAM for real-time data buffering and mid-rate signal processing tasks.
• Custom Embedded Logic – Replace discrete glue logic and ASIC prototypes with reprogrammable logic to accelerate development and enable field updates.

Unique Advantages

• High Logic Density: 24,576 logic elements and a 1,000,000-gate equivalent enable substantial on-chip implementation of custom digital designs without external ASICs.
• Generous I/O Count: 300 user I/Os support complex connectivity needs and reduce the need for external I/O expanders.
• Integrated On-Chip Memory: Approximately 0.147 Mbits of embedded RAM for buffering and local data storage, simplifying board-level memory requirements.
• Flash Configuration with Low-Power Modes: Series-level Flash*Freeze technology provides flash-based configuration and low-power operation characteristics referenced in the ProASIC3 family documentation.
• Industrial Thermal Performance: Rated −40 °C to 100 °C to withstand a wide range of industrial operating conditions.
• Compact High-Pin-Count Package: 484-BGA (23 × 23 FPBGA) offers a dense footprint for systems requiring many I/Os in a surface-mount form factor.

Why Choose M1A3P1000-2FG484I?

The M1A3P1000-2FG484I combines substantial logic capacity, ample embedded memory, and a high I/O count in a single surface-mount 484-BGA package optimized for industrial environments. Its flash-based configuration approach (ProASIC3 family) and stated low-power series features make it appropriate for designs that need reprogrammable logic with controlled power profiles and field update capability.

This device is suited for engineers building mid-density FPGA solutions for industrial control, I/O-heavy embedded systems, and custom logic functions that benefit from on-board RAM and a broad temperature operating window. The combination of voltage, thermal, packaging, and compliance characteristics supports dependable deployment and lifecycle maintenance in industrial applications.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the M1A3P1000-2FG484I and to discuss how it can fit your next industrial FPGA design.