M1A3P1000-2FG144I

The M1A3P1000-2FG144I is an industrial-grade, flash-based FPGA from Microchip Technology’s Military ProASIC3/EL family. It combines a substantial logic fabric and embedded RAM with a low-power flash architecture and Flash*Freeze technology to support complex control, signal-processing and I/O-centric functions.

Designed for environments requiring extended temperature operation and compact board-level integration, this device delivers 24,576 logic elements, approximately 147,456 bits of on-chip RAM, and 97 I/O in a 144-LBGA (13×13) surface-mount package.

Key Features

• Core Logic  24,576 logic elements (cells) and an estimated 1,000,000 gates for implementing complex digital functions and state machines.
• Embedded Memory  147,456 bits of on-chip RAM (approximately 0.147 Mbits) for buffering, FIFOs and small data stores.
• I/O Count  97 general-purpose I/O pins to support a wide range of external interfaces and peripheral connections.
• Flash-Based, Low Power  Part of the ProASIC3/EL flash FPGA family featuring Flash*Freeze technology for reduced power modes and non-volatile configuration.
• Power Supply  Operates from a core voltage range of 1.425 V to 1.575 V for regulated system integration.
• Package & Mounting  144-LBGA (supplier package: 144-FPBGA, 13 × 13) in a surface-mount form factor for compact PCB designs.
• Operating Range & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for harsh-environment deployments.
• Regulatory  RoHS compliant.

Typical Applications

• Aerospace & Defense systems  Flash-based FPGA configuration and rugged temperature range make this device suitable for military and aerospace logic integration and subsystem control.
• Industrial control  Use in motor control, PLC peripherals and factory automation where extended temperature operation and a high I/O count are required.
• Communications & networking equipment  On-board packet processing, protocol bridging or control plane logic that leverage the device’s logic density and embedded RAM.

Unique Advantages

• High logic density: 24,576 logic elements provide the capacity to consolidate multiple discrete functions into a single FPGA, reducing BOM and board complexity.
• Non-volatile flash configuration: Flash-based architecture with Flash*Freeze technology enables low-power standby modes and retains configuration without external memory.
• Compact board footprint: 144-LBGA (13×13) package offers a small form factor for space-constrained designs while preserving ample I/O.
• Industrial temperature capability: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• Controlled core voltage: Narrow 1.425 V–1.575 V supply range simplifies power sequencing and voltage regulation design.
• RoHS compliance: Meets lead-free requirements for commercial and industrial production flows.

Why Choose M1A3P1000-2FG144I?

The M1A3P1000-2FG144I positions itself as a flash-based FPGA option for designs that require substantial logic resources, embedded RAM, and a moderate I/O count in a compact LBGA package. Its industrial temperature rating and flash configuration retention make it a practical choice for applications where long-term configuration stability and low-power standby behavior matter.

Engineers designing for defense, industrial automation, and communications equipment will find the combination of logic density, on-chip memory, and Flash*Freeze capability useful for consolidating functionality and simplifying system architecture, all backed by Microchip Technology documentation for integration and deployment.

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