M1A3P1000-1PQ208

The M1A3P1000-1PQ208 is a ProASIC3 flash-based FPGA offered in a 208-BFQFP (208-PQFP, 28×28) surface-mount package. It provides a combination of moderate logic density, on-chip RAM, and I/O capacity for embedded digital designs where low-power flash configuration and flexible I/O are required. Typical use cases include communications, industrial and data-center related applications that benefit from reprogrammable logic and low-power operation.

Key Features

• Logic Capacity — 24,576 logic elements (listed as 24,576 CLBs/LABs equivalent), supporting designs up to 1,000,000 gates for mid-density FPGA applications.
• On‑Chip Memory — Approximately 0.147 Mbits of embedded RAM (147,456 total RAM bits) to support buffering, small FIFOs, and local data storage.
• I/O and Packaging — 154 user I/O available in a 208-BFQFP surface-mount package (supplier package: 208-PQFP, 28×28) for compact board-level integration.
• Low-Power Flash Configuration — Flash-based architecture with Flash*Freeze technology referenced in the ProASIC3 family datasheet, enabling non-volatile configuration and low-power retention modes.
• Power Supply — Single core voltage requirement of 1.425 V to 1.575 V for device operation.
• Commercial Temperature Grade — Specified for 0 °C to 85 °C operation, appropriate for commercial-temperature range applications.
• Regulatory — RoHS compliant.

Typical Applications

• Communications Equipment — Implement protocol bridging, packet handling, and custom interface logic using the device’s logic capacity and abundant I/O.
• Industrial Control — Use as control and glue logic in automation, where reprogrammable logic and low-power non-volatile configuration are advantageous.
• Data Center and Network Systems — Apply for intermediate-density logic functions, control plane tasks, and custom data-path processing that require on-chip RAM and flexible I/O.
• Aerospace & Defense Systems (Non-Military Grade Part) — Suitable for certain commercial-temperature embedded systems in these markets where flash-based configuration and moderate logic density are appropriate; note this specific part is specified as commercial grade.

Unique Advantages

• Flash-based, non-volatile configuration: Flash configuration provides instant-on behavior and persistent programming without external configuration memory.
• Balanced logic and memory: 24,576 logic elements combined with approximately 0.147 Mbits of embedded RAM supports a wide range of mid-density designs without external memory for small datasets.
• Generous I/O count in a compact package: 154 user I/O in a 208-BFQFP package enables dense connectivity while conserving board area.
• Predictable power domain: Narrow core voltage range (1.425 V–1.575 V) simplifies power-supply planning for the FPGA core.
• Commercial temperature and RoHS compliance: Rated 0 °C–85 °C and RoHS compliant for standard commercial deployments and regulatory considerations.

Why Choose M1A3P1000-1PQ208?

The M1A3P1000-1PQ208 positions itself as a mid-density ProASIC3 flash FPGA that pairs 24,576 logic elements and 154 I/O with non-volatile, low-power flash configuration. Its on-chip RAM and 1,000,000-gate equivalent capacity make it suitable for embedded controllers, protocol logic, and interface consolidation in commercial-temperature applications.

Engineers selecting this part gain a compact, surface-mount package and a predictable electrical and thermal envelope (1.425 V–1.575 V core, 0 °C–85 °C), backed by RoHS compliance and the ProASIC3 family’s flash-based configuration approach for persistent, low-power deployment.

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