M1A3P1000-1FGG484

IC FPGA 300 I/O 484FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA

Quantity 36 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O300Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M1A3P1000-1FGG484 – ProASIC3 Field Programmable Gate Array (FPGA) IC

The M1A3P1000-1FGG484 is a ProASIC3 Flash-based FPGA in a 484-BGA package designed for commercial applications requiring reprogrammable logic, significant I/O capacity, and on-chip embedded memory. Built for designs that need up to 24,576 logic elements and one million equivalent gates, this device targets mid- to high-density FPGA applications where low power, single-chip integration and flexible I/O are important.

This surface-mount device offers 300 user I/Os, approximately 147,456 bits of embedded RAM, and a narrow core supply range (1.425 V to 1.575 V), making it suitable for compact, power-conscious designs that must operate across a commercial temperature range (0 °C to 85 °C).

Key Features

  • Logic Capacity  24,576 logic elements (equivalent CLBs) and approximately 1,000,000 system gates enable mid- to high-density logic implementations.
  • Embedded Memory  Approximately 147,456 bits of on-chip RAM for data buffering, FIFOs, and small embedded memory requirements.
  • Rich I/O  Up to 300 user I/Os provided in the 484-BGA package to support wide peripheral and bus connectivity.
  • Flash-Based Reprogrammability  Nonvolatile, reprogrammable flash architecture retains designs when powered off and supports in-system updates.
  • Security and In-System Programming  Series-level features include on-chip AES-based decryption for secure ISP and FlashLock protection to safeguard FPGA contents.
  • Power and Voltage  Core supply specified at 1.425 V to 1.575 V (1.5 V class operation) for low-power operation; supports mixed I/O voltage operation as part of the family architecture.
  • Clocking  Clock conditioning and PLL capabilities are available within the ProASIC3 family architecture to support flexible clock management.
  • Package & Assembly  484-BGA (supplier device package 484-FPBGA, 23 × 23 mm) surface-mount package suitable for compact PCB footprints.
  • Operating Range & Compliance  Commercial grade operation from 0 °C to 85 °C and RoHS-compliant device construction.

Typical Applications

  • Consumer Electronics  Implement control logic, user interfaces, and protocol bridging in portable or battery-assisted products where low-power, nonvolatile FPGA behavior is advantageous.
  • Communications & Networking  Use as a mid-density logic engine for protocol conversion, packet buffering, and timing control leveraging abundant I/O and embedded RAM.
  • Industrial Automation (Commercial Equipment)  Control and interface functions in commercial automation systems that operate within a 0 °C to 85 °C range and require reprogrammable logic.
  • Instrumentation & Test  Custom signal processing, gating, and timing functions that benefit from on-chip memory and flexible clock conditioning.

Unique Advantages

  • High Logic Density: Delivers 24,576 logic elements and 1,000,000 system gates to implement complex designs without moving to larger form factors.
  • Significant I/O Count: 300 user I/Os in a 484-BGA provide broad connectivity for multi-channel interfaces and mixed-signal front ends.
  • Nonvolatile, Reprogrammable: Flash-based architecture retains programmed designs when power is removed and enables in-system reprogramming for field updates.
  • Compact, Surface-Mount Package: The 23 × 23 mm 484-FPBGA package supports dense PCB layouts while maintaining extensive I/O and memory resources.
  • Commercial Temperature Suitability: Rated for 0 °C to 85 °C to match commercial-grade product deployment and testing environments.
  • Regulatory Compliance: RoHS-compliant construction supports current environmental requirements for commercial electronics.

Why Choose M1A3P1000-1FGG484?

The M1A3P1000-1FGG484 balances substantial logic resources, a high I/O count, and on-chip memory in a compact 484-BGA package, providing a versatile platform for commercial electronic designs that demand reprogrammability and low-power operation. Its flash-based architecture and family-level security features make it suitable for applications that require retained configuration and controlled in-system updates.

This device is well suited to engineers and product teams developing mid- to high-density FPGA solutions who need a single-chip, reprogrammable option with broad I/O and embedded memory while maintaining a commercial operating temperature range and RoHS compliance.

Request a quote or submit a product inquiry to get pricing, availability, and additional technical support for M1A3P1000-1FGG484.

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