M1A3P1000-1FGG256

The M1A3P1000-1FGG256 is a ProASIC3 family flash-based FPGA in a 256-LBGA package offering high I/O density and substantial on-chip memory for commercial embedded designs. Built for low-power, secure, instant-on operation, this device addresses applications where integration, reprogrammability, and reliable nonvolatile configuration are required.

With 24,576 logic elements, 147,456 bits of embedded RAM, and 177 user I/Os, the M1A3P1000-1FGG256 targets high-density logic integration in portable, consumer, and other fast-moving markets where time-to-market and flexibility matter.

Key Features

• Core Capacity — 24,576 logic elements (cells) and 1,000,000 system gates provide substantial programmable logic for complex designs.
• Embedded Memory — 147,456 bits of on-chip RAM (approximately 0.147 Mbits) for FIFOs, buffers, and data storage.
• I/O Density & Flexibility — 177 user I/Os to support multiple interfaces and mixed-voltage operation on ProASIC3 family devices.
• Nonvolatile, Flash-Based Architecture — Flash configuration technology retains programmed design when powered off and supports instant-on operation.
• Security and In-System Programming — Series-level features include on-chip 128-bit AES decryption for JTAG ISP and FlashLock™ protection to secure FPGA contents.
• Performance — Series devices support high system performance (datasheet cites up to 350 MHz system performance for the family).
• Power and Voltage — Core supply range specified at 1.425 V to 1.575 V for low-voltage core operation; suitable for low-power system designs.
• Package & Mounting — 256-LBGA / 256-FPBGA (17 × 17) supplier device package; surface-mount mounting type for modern PCB assembly.
• Commercial Temperature Grade — Operating temperature range 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

• Portable Consumer Electronics — Integration of control logic, user interfaces, and low-power data paths in battery-backed or portable devices.
• Secure Embedded Systems — Designs that require nonvolatile configuration and hardware-level content protection during in-system programming.
• Rapid Product Development — Prototyping and time-to-market driven products that benefit from reprogrammable logic and instant-on capability.
• High-Density Logic Integration — Applications needing many I/Os and substantial logic elements for combining multiple functions into a single chip solution.

Unique Advantages

• Nonvolatile Flash Configuration: Retains programmed design when power is removed, enabling instant-on behavior and eliminating separate configuration devices.
• High Logic and I/O Capacity: 24,576 logic elements and 177 user I/Os reduce the need for multiple chips and simplify board-level integration.
• On-Chip Memory: 147,456 bits of embedded RAM provide local buffering and storage for data-centric functions without external memory.
• Built-In Security Features: Series-level AES-based ISP and FlashLock™ support protect IP and enable secure field updates.
• Low-Voltage Core Operation: A tight core supply window (1.425–1.575 V) supports low-power designs and aligns with modern power-rail conventions.
• Commercial-Grade and RoHS Compliant: Designed for commercial temperature ranges (0 °C to 85 °C) and environmental compliance for broad market acceptance.

Why Choose M1A3P1000-1FGG256?

The M1A3P1000-1FGG256 combines a high count of logic elements and user I/Os with nonvolatile flash configuration and on-chip memory to deliver a compact, reprogrammable solution for commercial embedded designs. Its low-voltage core, security-capable ISP features, and LBGA footprint make it suitable for portable, consumer, and other time-sensitive product lines where integration and secure in-field updates matter.

Engineers and procurement teams looking to consolidate functions, protect design IP, and accelerate time to market will find the M1A3P1000-1FGG256 a practical option within the ProASIC3 family, backed by family-level features documented in the datasheet.

Request a quote or submit an inquiry to discuss availability, pricing, and how the M1A3P1000-1FGG256 can fit into your next embedded design.