M1A3P1000-1FG484I

The M1A3P1000-1FG484I is a ProASIC3 Field Programmable Gate Array (FPGA) IC designed for industrial applications. It provides a flash-based, low-power configurable fabric with 24,576 logic elements, approximately 0.15 Mbits of embedded RAM, and up to 300 user I/O pins, enabling complex, reconfigurable digital designs.

This device targets systems that require high pin count, a mid-range logic capacity and robust operating conditions, offering designers a balance of integration, flexibility and industrial-temperature operation.

Key Features

• Core Logic  24,576 logic elements (cells) supporting up to 1,000,000 equivalent gates for implementing combinational and sequential logic.
• Embedded Memory  Total on-chip RAM of 147,456 bits (approximately 0.15 Mbits) for buffering, state storage and local data paths.
• I/O Capacity  Up to 300 user I/O pins to support multiple interfaces and high pin-count system designs.
• Package  484-ball BGA package (supplier device package: 484-FPBGA, 23 × 23 mm) in a surface-mount form factor for dense board layouts.
• Power Supply  Nominal core voltage range 1.425 V to 1.575 V to support stable core operation within specified limits.
• Operating Range  Industrial operating temperature range from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Mounting & Grade  Surface-mount device, specified as Industrial grade to meet industrial system requirements.
• Technology Family  Part of the ProASIC3 series (Flash-based FPGA architecture), as described in the device family documentation.
• Reliability Indicators  RoHS compliant.

Typical Applications

• Industrial Control  Use the high I/O count and industrial temperature rating for motor control interfaces, sensor aggregation and machine automation logic.
• Communications Equipment  Deploy the device in mid-density protocol bridging, interface adaptation and custom packet processing where reconfigurability is required.
• Data Acquisition & Processing  Leverage the embedded RAM and logic resources for local buffering, data conditioning and pre-processing in test and measurement systems.

Unique Advantages

• Balanced Logic and Memory  24,576 logic elements combined with approximately 0.15 Mbits of on-chip RAM provide a practical balance for mid-range FPGA designs without external memory dependence.
• High Pin Count  300 I/O pins enable designs that require multiple parallel interfaces or extensive sensor/actuator connectivity, reducing the need for external multiplexing.
• Industrial Temperature Range  Rated from −40 °C to 100 °C for deployment in demanding ambient conditions typical of industrial applications.
• Compact BGA Package  484-ball FPBGA (23 × 23 mm) provides high connectivity in a compact surface-mount footprint suitable for space-constrained PCBs.
• Flash-Based ProASIC3 Family  Built on a flash-configurable FPGA architecture, as indicated in the device family documentation, supporting in-field reconfiguration and stable non-volatile configuration.
• Defined Core Supply Range  A specified core voltage window (1.425 V–1.575 V) helps designers plan power distribution and voltage regulation precisely.

Why Choose M1A3P1000-1FG484I?

The M1A3P1000-1FG484I positions itself as a robust mid-density FPGA option that combines a substantial logic element count with a high I/O complement and on-chip RAM. Its industrial temperature rating and BGA packaging make it appropriate for systems that require reliable, reconfigurable logic in compact board designs.

Designers seeking a flash-based FPGA from the ProASIC3 family will find this device suitable for applications that demand reconfigurability, moderate logic capacity and a high number of external interfaces, while maintaining clear electrical and thermal operating boundaries.

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