M1A3P1000-1FG256I

The M1A3P1000-1FG256I is a ProASIC3 flash-based FPGA IC in a 256-LBGA package. It delivers 1,000,000 gates with 24,576 logic elements and 177 I/Os for industrial embedded applications that require mid-to-high density programmable logic and flexible I/O connectivity.

Designed for industrial environments, the device combines on-chip RAM, a dense I/O count, and a compact 256-FPBGA (17×17) supplier package, and operates across a wide industrial temperature range with a defined core supply voltage window.

Key Features

• Core Capacity  1,000,000 gates and 24,576 logic elements provide a substantial programmable fabric for glue logic, state machines, and mid-density custom logic functions.
• Embedded Memory  147,456 bits of on-chip RAM (approximately 0.147 Mbits) for buffering, state storage, and small embedded data structures.
• I/O Density & Package  177 user I/Os in a 256-LBGA package (supplier package: 256-FPBGA, 17×17) enables high pin-count connectivity in a compact footprint. Surface-mount mounting supports standard PCB assembly.
• Power Supply Range  Specified core voltage supply from 1.425 V to 1.575 V for controlled power-domain design and predictable power budgeting.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to match industrial temperature requirements.
• Flash-Based Architecture & Family Feature  Part of the ProASIC3 family and documented in the family datasheet to include Flash*Freeze technology as a series-level feature.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Implement motor control logic, I/O conditioning, and protocol bridging where 177 I/Os and industrial temperature operation are required.
• Embedded Systems  Use as system glue logic, bus interfacing, and custom peripheral implementation leveraging 24,576 logic elements and on-chip RAM.
• Communication Interfaces  Implement custom interface logic, data aggregation, and buffering using the device’s I/O density and embedded memory.

Unique Advantages

• High functional density: 1,000,000 gates and 24,576 logic elements let you consolidate multiple discrete functions into a single device, reducing BOM and board area.
• Compact, high-pin-count package: 256-LBGA (256-FPBGA 17×17) provides significant I/O in a space-efficient footprint for dense PCB layouts.
• Industrial-ready thermal range: −40 °C to 100 °C supports deployment in industrial environments without external derating of the device rating.
• Controlled power domain: A defined core voltage window (1.425 V to 1.575 V) simplifies power-supply design and margin planning.
• Flash-based family features: Inclusion in the ProASIC3 family (datasheet documents Flash*Freeze technology at the series level) provides a flash-configured FPGA option for applications that benefit from non-volatile configuration.
• Regulatory readiness: RoHS compliance supports use in markets and designs that require lead-free assembly.

Why Choose M1A3P1000-1FG256I?

The M1A3P1000-1FG256I positions itself as a versatile flash-based FPGA for industrial embedded designs that need a balance of logic capacity, memory, and high I/O count in a compact 256-LBGA package. Its 1,000,000 gates, 24,576 logic elements, and 177 I/Os make it suitable for consolidating custom logic, interface functions, and buffering within a single programmable device.

With an industrial temperature rating, explicit core supply range, and RoHS compliance, this ProASIC3 device offers predictable electrical and thermal boundaries for engineers targeting long-lived industrial applications where reprogrammability and integration reduce system complexity.

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