M1A3P1000-1FG144

The M1A3P1000-1FG144 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology, offered in a 144‑lead FPBGA (13×13) surface-mount package. It delivers a balanced combination of logic capacity, embedded memory, and I/O density suitable for commercial embedded designs.

With 24,576 logic elements, approximately 144,000 bits of on-chip RAM and 97 user I/Os, this device targets applications that require reprogrammable logic, moderate embedded memory, and a compact BGA footprint. The device operates from a fixed supply of 1.425 V and is rated for commercial temperature operation (0 °C to 85 °C).

Key Features

• Core Logic 24,576 logic elements providing approximately 1,000,000 gates of implementation capacity for custom logic and control functions.
• Embedded Memory Approximately 144,000 bits (≈0.144 Mbits) of on‑chip RAM for data buffering, FIFOs, and small lookup tables.
• Flexible I/O 97 user I/Os suitable for interfacing to peripherals, sensors, and serial/parallel buses in compact systems.
• Nonvolatile Flash Configuration Family documentation references Flash*Freeze Technology for low‑power flash-based configuration and retention behavior.
• Power Single fixed supply voltage: 1.425 V, enabling predictable power delivery and design planning.
• Package & Mounting 144‑FPBGA (13×13) surface-mount package supplied in tray format for volume assembly.
• Operating Range & Compliance Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• Communications Protocol bridging, custom packet processing, or interface adaptation where moderate logic density and embedded RAM are required.
• Data Processing & Acceleration Small-scale data path acceleration, buffering and control logic in compact systems that benefit from reprogrammable logic.
• Industrial & Embedded Control Sensor aggregation, I/O conditioning and deterministic control tasks in commercial embedded products.

Unique Advantages

• Significant Logic Density: 24,576 logic elements and an approximate 1,000,000‑gate capacity enable complex finite state machines, datapaths and peripheral integration within a single device.
• Embedded Memory for On‑Chip Storage: Approximately 144,000 bits of RAM reduce external memory requirements for buffering and temporary storage.
• Compact BGA Footprint: 144‑FPBGA (13×13) package supports high‑density board designs while preserving robust I/O counts.
• Deterministic Power Specification: Single 1.425 V supply simplifies power rail design and component selection.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronics applications.
• Nonvolatile Configuration Technology: Flash-based configuration (Flash*Freeze Technology referenced in family datasheet) supports nonvolatile device configuration and low‑power retention modes.

Why Choose M1A3P1000-1FG144?

The M1A3P1000-1FG144 provides a pragmatic balance of logic capacity, embedded memory and I/O in a compact 144‑FPBGA package, making it well suited for commercial embedded systems that require reprogrammable logic and on‑chip RAM without large package footprints. Its fixed 1.425 V supply and commercial temperature rating simplify system integration for volume designs.

Designed for engineers who need reprogrammable logic with nonvolatile flash configuration characteristics, this FPGA is a practical choice for communication interfaces, embedded control and data processing tasks where reliability, predictable power, and package density matter.

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