LIFCL-40-9SG72I

The LIFCL-40-9SG72I is a CrossLink-NX™ Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, offered in a compact 72-VFQFN exposed pad package. It provides a balance of programmable logic capacity, embedded memory, and I/O count tailored for industrial-grade embedded designs.

With 39,000 logic elements, approximately 1.55 Mbits of on-chip RAM, 40 user I/Os, and a 0.95–1.05 V core supply range, this surface-mount FPGA supports designs that require moderate logic density, embedded memory, and robust temperature operation from −40 °C to 100 °C.

Key Features

• Core Logic 39,000 logic elements for implementing custom digital logic, state machines, and control functions.
• Embedded Memory Approximately 1.55 Mbits of on-chip RAM to support buffers, FIFOs, and small data stores without external memory.
• I/O Count 40 user I/Os suitable for interfacing sensors, controls, and peripheral devices in compact systems.
• Power Core voltage supply range of 0.95 V to 1.05 V to match low-voltage system architectures.
• Package & Mounting 72-VFQFN exposed pad (72-QFN, 10×10) in a surface-mount package for compact PCB footprint and thermal dissipation.
• Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C, supporting extended temperature envelope applications.
• Environmental Compliance RoHS compliant for alignment with common environmental and manufacturing requirements.

Typical Applications

• Industrial Control — Implement custom control logic, timing, and I/O arbitration for factory automation and machine control systems within an industrial temperature range.
• Embedded Systems — Provide programmable logic and on-chip RAM for embedded compute tasks, preprocessing, and glue logic in compact boards.
• Sensor and Peripheral Interface — Aggregate and condition signals from multiple sensors or peripherals using available I/Os and internal logic resources.

Unique Advantages

• High Logic Density: 39,000 logic elements enable substantial programmable functionality in a single device, reducing external component count.
• On-Chip Memory: Approximately 1.55 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary data storage.
• Compact, Thermally Efficient Package: 72-VFQFN exposed pad (10×10 QFN) offers a small PCB footprint with a thermal path for heat dissipation.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in extended-temperature environments.
• Low-Voltage Core Support: 0.95–1.05 V core supply compatibility for modern low-voltage system designs.
• RoHS Compliant: Meets common environmental compliance expectations for manufacturing and distribution.

Why Choose LIFCL-40-9SG72I?

The LIFCL-40-9SG72I positions itself as a mid-density, industrial-grade FPGA option that combines substantial logic resources, embedded memory, and a practical I/O count in a compact QFN package. Its operating temperature range and RoHS compliance make it suitable for long-lived embedded and industrial designs where predictable thermal and environmental behavior is required.

This device is well suited to engineers and designers building compact systems that need programmable logic and on-chip RAM without extensive external components, offering a straightforward path to integrating custom functionality while maintaining a small PCB footprint.

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