LIFCL-40-9SG72C

The LIFCL-40-9SG72C is a CrossLink-NX™ field programmable gate array (FPGA) designed for commercial embedded applications requiring programmable logic, on-chip memory, and flexible I/O in a compact surface-mount package. It integrates approximately 39,000 logic elements and about 1.55 Mbits of embedded memory to support a wide range of custom logic and interface tasks.

With a 40‑pin I/O count, low-voltage core supply range (950 mV to 1.05 V), and a 72‑VFQFN exposed pad package (72‑QFN, 10 × 10 mm), this device targets space-conscious designs that need programmable functionality while meeting commercial temperature and RoHS compliance requirements.

Key Features

• Core Logic Capacity  Approximately 39,000 logic elements provide substantial programmable logic for glue logic, protocol adaptation, and custom state machines.
• Configurable Logic Blocks  Around 9,750 configurable logic blocks (CLBs) for structured logic partitioning and design modularity.
• On‑Chip Memory  Approximately 1.55 Mbits of embedded memory to store buffers, LUTs, and small data structures without external RAM.
• I/O Count  40 available I/Os support multiple peripheral interfaces or mixed-signal front-ends when combined with external interface components.
• Power  Core supply range of 950 mV to 1.05 V enables low-voltage system integration and predictable power rails for modern embedded platforms.
• Package & Mounting  72‑VFQFN exposed pad package (72‑QFN, 10 × 10 mm) in a surface-mount form factor for compact PCB layouts and thermal grounding via the exposed pad.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Typical Applications

• Embedded Control  Implement custom state machines, protocol handling, or timing-critical control functions within commercial embedded systems.
• Interface Bridging  Bridge or adapt signals between different peripherals and subsystems using the FPGA’s programmable I/O and logic resources.
• Prototype and Development  Rapidly prototype custom logic and validate system-level integration in a compact, surface-mount package.
• Glue Logic and Acceleration  Offload deterministic, repetitive tasks from a host processor to dedicated programmable logic to simplify system design.

Unique Advantages

• High Logic Density: Approximately 39,000 logic elements enable significant integration of custom logic without external CPLDs or multiple ICs.
• Substantial On‑Chip Memory: About 1.55 Mbits of embedded RAM reduces dependency on external memory for buffers and look-up storage.
• Compact, Thermally Managed Package: 72‑VFQFN with exposed pad (10 × 10 mm) supports compact board layouts and thermal grounding for stable operation.
• Low-Voltage Core: 950 mV to 1.05 V core supply enables integration into modern low-voltage power domains.
• Commercial Temperature and RoHS Compliance: Designed for 0 °C to 85 °C operation and RoHS-compliant manufacturing environments.
• Surface-Mount Form Factor: Surface-mount mounting simplifies automated assembly and footprint optimization on PCBs.

Why Choose LIFCL-40-9SG72C?

The LIFCL-40-9SG72C delivers a balanced combination of logic capacity, embedded memory, and compact packaging for commercial embedded designs that require programmable logic and flexible I/O. Its low-voltage core supply and exposed‑pad QFN package make it suitable for space-constrained boards where thermal management and power-rail compatibility are important considerations.

This part is well suited to engineers and product teams looking to consolidate discrete logic, implement custom interfaces, or prototype new functions in a RoHS‑compliant, commercially rated FPGA. The device’s mix of logic elements, on‑chip RAM, and 40 I/Os provides scalable integration for a variety of programmable tasks within commercial temperature ranges.

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