M1A3P1000L-1FG256
| Part Description |
ProASIC3L Field Programmable Gate Array (FPGA) IC 177 147456 256-LBGA |
|---|---|
| Quantity | 435 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 177 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M1A3P1000L-1FG256 – ProASIC3L FPGA, 1,000,000 gates, 177 I/Os, 256‑LBGA
The M1A3P1000L-1FG256 is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology. It provides a hardware-configurable logic fabric with 24,576 logic elements and 1,000,000 gates, combined with embedded on-chip RAM and a high I/O count for dense integration.
This surface-mount FPGA is supplied in a 256-LBGA (vendor package: 256-FPBGA, 17×17 mm) and is specified for commercial-grade operation from 0 °C to 85 °C with a core supply range of 1.14 V to 1.575 V.
Key Features
- Logic Capacity 24,576 logic elements providing up to 1,000,000 gates for implementing complex combinational and sequential functions.
- Embedded Memory 147,456 bits of on-chip RAM for local data storage and buffering within the FPGA fabric.
- I/O Resources 177 general-purpose I/Os to support multiple interfaces and board-level connectivity requirements.
- Power Supply Supports a core voltage range of 1.14 V to 1.575 V, enabling precise supply selection for target system architectures.
- Package & Mounting 256‑LBGA package (supplier device package: 256‑FPBGA, 17×17 mm) designed for surface-mount assembly in compact designs.
- Operating Grade Commercial grade device rated for operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant for regulatory adherence in lead‑free assemblies.
Unique Advantages
- High logic density: 24,576 logic elements and 1,000,000 gates enable implementation of sizable custom logic blocks within a single device.
- On-chip RAM for local storage: 147,456 bits of embedded RAM reduce external memory dependence for buffering and state retention.
- Extensive I/O count: 177 I/Os allow broad interfacing options without immediate need for external I/O expanders.
- Compact, manufacturable package: 256‑LBGA (17×17 mm) surface-mount package supports compact PCB layouts and standard assembly processes.
- Commercial temperature rating: 0 °C to 85 °C operation suits typical commercial embedded systems and electronic products.
- RoHS compliant: Conforms to lead‑free manufacturing requirements for modern production environments.
Why Choose M1A3P1000L-1FG256?
The M1A3P1000L-1FG256 is positioned for designs that require substantial on-chip logic, embedded RAM, and a high number of I/Os in a compact surface-mount BGA package. Its combination of 24,576 logic elements, 147,456 bits of RAM, and 177 I/Os makes it suitable for projects needing significant programmable logic density and local memory resources.
As a Microchip Technology ProASIC3L device with a defined commercial operating range and RoHS compliance, it provides a clear specification set for procurement and integration into commercial electronic products where these electrical, thermal, and package characteristics match system requirements.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the M1A3P1000L-1FG256.

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