M1A3P1000L-1FG256

IC FPGA 177 I/O 256FBGA
Part Description

ProASIC3L Field Programmable Gate Array (FPGA) IC 177 147456 256-LBGA

Quantity 435 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O177Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M1A3P1000L-1FG256 – ProASIC3L FPGA, 1,000,000 gates, 177 I/Os, 256‑LBGA

The M1A3P1000L-1FG256 is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology. It provides a hardware-configurable logic fabric with 24,576 logic elements and 1,000,000 gates, combined with embedded on-chip RAM and a high I/O count for dense integration.

This surface-mount FPGA is supplied in a 256-LBGA (vendor package: 256-FPBGA, 17×17 mm) and is specified for commercial-grade operation from 0 °C to 85 °C with a core supply range of 1.14 V to 1.575 V.

Key Features

  • Logic Capacity 24,576 logic elements providing up to 1,000,000 gates for implementing complex combinational and sequential functions.
  • Embedded Memory 147,456 bits of on-chip RAM for local data storage and buffering within the FPGA fabric.
  • I/O Resources 177 general-purpose I/Os to support multiple interfaces and board-level connectivity requirements.
  • Power Supply Supports a core voltage range of 1.14 V to 1.575 V, enabling precise supply selection for target system architectures.
  • Package & Mounting 256‑LBGA package (supplier device package: 256‑FPBGA, 17×17 mm) designed for surface-mount assembly in compact designs.
  • Operating Grade Commercial grade device rated for operation from 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant for regulatory adherence in lead‑free assemblies.

Unique Advantages

  • High logic density: 24,576 logic elements and 1,000,000 gates enable implementation of sizable custom logic blocks within a single device.
  • On-chip RAM for local storage: 147,456 bits of embedded RAM reduce external memory dependence for buffering and state retention.
  • Extensive I/O count: 177 I/Os allow broad interfacing options without immediate need for external I/O expanders.
  • Compact, manufacturable package: 256‑LBGA (17×17 mm) surface-mount package supports compact PCB layouts and standard assembly processes.
  • Commercial temperature rating: 0 °C to 85 °C operation suits typical commercial embedded systems and electronic products.
  • RoHS compliant: Conforms to lead‑free manufacturing requirements for modern production environments.

Why Choose M1A3P1000L-1FG256?

The M1A3P1000L-1FG256 is positioned for designs that require substantial on-chip logic, embedded RAM, and a high number of I/Os in a compact surface-mount BGA package. Its combination of 24,576 logic elements, 147,456 bits of RAM, and 177 I/Os makes it suitable for projects needing significant programmable logic density and local memory resources.

As a Microchip Technology ProASIC3L device with a defined commercial operating range and RoHS compliance, it provides a clear specification set for procurement and integration into commercial electronic products where these electrical, thermal, and package characteristics match system requirements.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the M1A3P1000L-1FG256.

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