M1A3P1000L-1FGG144

The M1A3P1000L-1FGG144 is a ProASIC3L field programmable gate array (FPGA) IC offering a balance of logic capacity, embedded memory and I/O density in a compact 144-LBGA surface-mount package. With 24,576 logic elements and approximately 0.15 Mbits of on-chip RAM, it addresses designs that require programmable logic, moderate embedded memory and a substantial set of I/O pins within a commercial temperature range.

Key Features

• Logic Capacity  Provides 24,576 logic elements (LEs) suitable for complex programmable logic implementations and custom digital functions.
• Embedded Memory  Approximately 0.15 Mbits of total on-chip RAM (147,456 bits) for LUTs, FIFOs or small data buffering.
• I/O Resources  97 programmable I/O pins to support multiple interfaces and external peripherals.
• Gate Equivalent  Specified as 1,000,000 gates for design planning and resource estimation.
• Power and Supply  Operates from a core voltage range of 1.14 V to 1.575 V to match low-voltage system designs.
• Package and Mounting  144-LBGA package (supplier device package: 144-FPBGA 13×13) with surface-mount mounting for compact PCB implementations.
• Temperature Grade  Commercial operating temperature range of 0°C to 85°C for standard commercial applications.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

• Custom Digital Logic  Implement bespoke state machines, protocol conversion or glue logic using the device’s 24,576 logic elements and embedded RAM.
• Interface Bridging  Use the 97 I/Os to connect and translate between multiple external peripherals and interfaces.
• Prototyping and Development  Suitable for development platforms and proof-of-concept designs that require reprogrammable logic and moderate memory resources.

Unique Advantages

• High Logic Density:  24,576 logic elements provide significant programmable resources for complex logic integration without multiple discrete devices.
• Integrated Memory:  Approximately 0.15 Mbits of on-chip RAM reduces the need for some external memory components and supports local data buffering.
• Generous I/O Count:  97 I/Os allow flexible external connectivity and multiple simultaneous interface implementations.
• Compact Surface-Mount Package:  144-LBGA (144-FPBGA 13×13) enables dense PCB layouts while maintaining a standardized footprint.
• Low-Voltage Core:  1.14 V to 1.575 V core supply range supports integration in low-voltage systems.
• Regulatory Compliance:  RoHS compliant to support lead-free manufacturing and regulatory requirements.

Why Choose M1A3P1000L-1FGG144?

The M1A3P1000L-1FGG144 positions itself as a versatile, commercial-grade FPGA option for designers needing a substantial number of logic elements, embedded memory and I/O in a compact LBGA package. Its combination of 24,576 logic elements, approximately 0.15 Mbits of RAM and 97 I/Os makes it suitable for a wide range of programmable logic tasks where board space and integration matter.

For teams focused on scalable, reconfigurable designs, this device offers a clear specification set for resource planning and system integration, along with RoHS compliance and a standard commercial temperature rating for typical embedded applications.

Request a quote or contact sales to discuss availability, pricing and how the M1A3P1000L-1FGG144 can fit your next programmable logic design.