M1A3P1000L-1FGG256I

The M1A3P1000L-1FGG256I is a ProASIC3L field programmable gate array (FPGA) optimized for configurable digital logic implementations. It delivers a balance of logic capacity, on-chip memory and I/O count in a compact 256-LBGA package suited to surface-mount assembly.

Built to meet industrial temperature requirements and RoHS compliance, this device targets applications that require reliable operation across a wide voltage and temperature envelope while providing substantial gate count and embedded memory resources.

Key Features

• Logic Capacity  24,576 logic elements (LABs/CLBs) providing 1,000,000 gates for implementing complex programmable logic functions.
• Embedded Memory  147,456 bits of on-chip RAM, approximately 0.15 Mbits of embedded memory for data buffering and state storage.
• I/O Resources  177 user I/O pins to support a wide range of peripheral and bus interfaces.
• Power  Operates from a core voltage range of 1.14 V to 1.575 V to match system power architectures requiring low-voltage FPGA cores.
• Package & Mounting  256-LBGA package (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board designs.
• Temperature Rating  Industrial-grade operation from -40 °C to 100 °C for deployment in temperature-demanding environments.
• Compliance  RoHS compliant, supporting regulatory requirements for material composition.

Unique Advantages

• Substantial logic density: 24,576 logic elements and 1,000,000 gates enable implementation of sizable custom logic blocks without external ASICs.
• On-chip memory for buffering: Approximately 0.15 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
• High I/O count: 177 I/Os provide flexibility to connect multiple peripherals, sensors and buses directly to the FPGA fabric.
• Industrial temperature range: Rated from -40 °C to 100 °C for reliable operation in industrial environments.
• Compact, surface-mount package: 256-LBGA (256-FPBGA, 17×17) supports dense PCB layouts while maintaining manufacturability.
• Low-voltage core: Core supply range of 1.14 V to 1.575 V aligns with modern low-voltage system power rails.

Why Choose M1A3P1000L-1FGG256I?

The M1A3P1000L-1FGG256I positions itself as a mid-density ProASIC3L FPGA that combines meaningful logic capacity, on-chip RAM and a substantial I/O complement in an industrial-temperature, surface-mount package. Its 1,000,000-gate capacity and 24,576 logic elements make it suitable for designs that require scalable programmable logic while maintaining compact board footprint and low-voltage operation.

Choose this device for applications that require reliable, configurable logic with on-chip memory and broad I/O in industrial environments—offering a clear balance of integration, thermal range and manufacturable packaging.

Request a quote or submit an inquiry for pricing and availability to evaluate the M1A3P1000L-1FGG256I for your next programmable-logic design.