M1A3P1000L-FGG144

The M1A3P1000L-FGG144 is a ProASIC3L field programmable gate array (FPGA) IC delivering a mid-range mix of logic, embedded memory and I/O capability in a compact 144-LBGA package. With 24,576 logic elements and approximately 0.147 Mbits of on-chip RAM, this device is intended for designs that require programmable logic density, moderate embedded memory and a sizeable number of external I/Os.

Designed for surface-mount assembly and commercial temperature operation, the device supports supply voltages from 1.14 V to 1.575 V and is RoHS compliant, providing a verifiable platform for volume and production designs that fit within its electrical and thermal envelope.

Key Features

• Core Logic 24,576 logic elements (cells) supporting up to 1,000,000 gates for implementing custom combinational and sequential logic blocks.
• Embedded Memory Approximately 0.147 Mbits of on-chip RAM for buffering, FIFOs, and small data storage structures without external memory.
• I/O Resources 97 I/Os available for interfacing with peripherals, sensors, and external devices.
• Power Supported supply voltage range from 1.14 V to 1.575 V to match system power rails and design requirements.
• Package and Mounting 144-LBGA package (supplier package: 144-FPBGA 13×13) in a surface-mount form factor for compact board layouts.
• Operating Conditions Commercial temperature grade with an operating range of 0°C to 85°C.
• Compliance RoHS compliant material status for regulatory and environmental considerations.

Typical Applications

• Custom Control Logic Implement mid-density control and glue logic where ~24,576 logic elements enable consolidation of multiple discrete components into programmable logic.
• Protocol Bridging and I/O Expansion Use the 97 available I/Os to bridge interfaces or expand I/O capability between system components.
• Embedded Memory Functions Leverage approximately 0.147 Mbits of on-chip RAM for small buffers, FIFOs, and temporary data storage without adding external memory devices.

Unique Advantages

• Significant Logic Capacity: 24,576 logic elements and 1,000,000 gates provide capacity to implement substantial custom logic and state machines within a single device.
• Integrated Embedded Memory: Approximately 0.147 Mbits of on-chip RAM reduces dependence on external memories for short-term storage and buffering.
• Ample I/O Count: 97 I/Os enable flexible board-level integration and support for multiple external interfaces without additional I/O expanders.
• Compact, Production-Friendly Package: 144-LBGA (144-FPBGA 13×13) surface-mount package supports dense PCB layouts and automated assembly processes.
• Clear Operational Envelope: Defined supply voltage range (1.14 V–1.575 V) and commercial operating temperature (0°C–85°C) simplify system power and thermal planning.
• Regulatory Compliance: RoHS compliance supports environmental and regulatory requirements for production deployments.

Why Choose M1A3P1000L-FGG144?

The M1A3P1000L-FGG144 positions itself as a commercially graded, mid-density FPGA solution offering a balance of logic resources, embedded memory and I/O in a compact LBGA package. Its defined supply voltage range and operating temperature make it suitable for commercial applications where a programmable hardware platform is needed to consolidate logic, manage interfaces and implement buffering without excessive board-level complexity.

This device is well suited to engineers and OEMs designing systems that require a reliable, RoHS-compliant FPGA with substantial logic capacity and on-chip memory while maintaining a compact footprint for automated assembly and production runs.

Request a quote or submit a pricing inquiry today to confirm availability and receive ordering information for the M1A3P1000L-FGG144.