M1AGL1000V2-FG256

The M1AGL1000V2-FG256 is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology provided in a 256-LBGA surface-mount package. It delivers a balance of on-chip logic, embedded memory and I/O capacity in a commercial-grade FPGA footprint.

With 24,576 logic elements, approximately 147,456 bits of embedded RAM, up to 177 I/Os and an estimated 1,000,000 gates, this device targets designs that require substantial logic density and on-chip memory while operating at low supply voltages (1.14 V to 1.575 V) within a 0 °C to 70 °C temperature range.

Key Features

• Core / Logic  24,576 logic elements (LEs) provide the primary programmable fabric for implementing custom logic functions and digital processing.
• Embedded Memory  Approximately 147,456 bits of on-chip RAM for data buffering, FIFOs and state storage close to the logic.
• I/O Capacity  Up to 177 general-purpose I/Os to support multiple interfaces and board-level signal routing.
• Gate Count  An estimated 1,000,000 gates for complex logic implementations and system integration.
• Power and Voltage  Operates from 1.14 V to 1.575 V, enabling integration into low-voltage power domains.
• Package & Mounting  256-LBGA (supplier device package: 256-FPBGA, 17 × 17) in a surface-mount form factor for compact board designs.
• Commercial Temperature Grade  Rated for operation from 0 °C to 70 °C, suitable for standard commercial applications.
• Regulatory Compliance  RoHS compliant, supporting lead-free assembly and environmental sourcing requirements.

Typical Applications

• High-density I/O designs  Use the 177 available I/Os for multi-interface boards and complex peripheral integration.
• Memory-centric logic  Leverage approximately 147 kbits of on-chip RAM for buffering, packet handling or temporary storage close to logic elements.
• Compact surface-mount systems  The 256-LBGA package supports space-constrained board layouts where a high-density, surface-mount FPGA is required.
• Low-voltage designs  Ideal for systems operating within the 1.14 V to 1.575 V supply window where low-voltage FPGA integration is necessary.

Unique Advantages

• Substantial logic capacity: 24,576 logic elements enable implementation of complex digital functions without external glue logic.
• On-chip memory integration: Approximately 147 kbits of embedded RAM reduce dependence on external memory for many buffering and state storage needs.
• Generous I/O availability: 177 I/Os simplify board-level connectivity and support multiple interfaces on a single device.
• Compact, manufacturable package: 256-LBGA surface-mount package supports modern PCB assembly and compact system designs.
• Commercial-grade suitability: Rated for 0 °C to 70 °C operation and RoHS compliant for standard commercial deployments.

Why Choose M1AGL1000V2-FG256?

The M1AGL1000V2-FG256 offers a balanced combination of logic density, embedded memory and I/O capability in a compact 256-LBGA surface-mount package. Its low-voltage operation and commercial temperature rating make it a practical choice for designers who need substantial on-chip resources without moving to larger or more complex packages.

This device is well suited for engineers and teams building medium-to-high-density programmable logic solutions that require integrated RAM and extensive I/O in a manufacturable surface-mount form factor. Its specification set supports scalable designs where on-chip resources and package density are priorities.

Request a quote or submit an inquiry to start the procurement process for M1AGL1000V2-FG256 and evaluate it for your next design.