M1AGL1000V2-FGG144

The M1AGL1000V2-FGG144 is an IGLOO field programmable gate array (FPGA) IC offering 24,576 logic elements and 97 user I/Os in a compact 144-LBGA package. It provides on-chip memory and a large logic resource count suitable for implementing custom digital logic and reconfigurable functions in electronic systems.

Designed for commercial-temperature operation and surface-mount assembly, this device balances integration and board-level density with a defined supply voltage range for system-level design.

Key Features

• Core Logic 24,576 logic elements enabling implementation of complex programmable logic functions and custom datapaths.
• Embedded Memory 147,456 bits of on-chip RAM (approximately 0.147 Mbits) for buffering, state storage, and small data structures.
• I/O Capacity 97 user I/Os for interfacing to peripherals, sensors, and board-level buses.
• Gate Equivalent 1,000,000 gates providing an indication of overall logic resource scale for system planning.
• Power Core supply range 1.14 V to 1.575 V, allowing design planning around specified operating voltages.
• Package and Mounting 144-LBGA (supplier device package 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB integration.
• Temperature and Grade Commercial grade with an operating temperature range of 0 °C to 70 °C for standard commercial applications.
• Regulatory RoHS compliant to support environmentally conscious manufacturing requirements.

Typical Applications

• Embedded Control Implement custom control logic and state machines where dedicated hardware flexibility is required.
• I/O Bridging and Glue Logic Provide protocol adaptation, bus bridging, and glue logic between disparate digital subsystems.
• Prototyping and Development Use for hardware prototyping and iterative logic development where reprogrammability accelerates design cycles.

Unique Advantages

• Substantial Logic Capacity: 24,576 logic elements support sizeable custom logic implementations without external ASIC development.
• Integrated Memory Resources: 147,456 bits of on-chip RAM reduce dependence on external memory for small buffers and state storage.
• Generous I/O Count: 97 I/Os enable multiple peripheral interfaces and board-level connectivity options.
• Compact Surface-Mount Package: 144-LBGA (13×13) allows high-density PCB designs while preserving board real estate.
• Defined Power Envelope: Core voltage range of 1.14 V to 1.575 V supports clear power-supply planning during system design.
• RoHS Compliant: Meets environmental compliance requirements for lead-free assembly and manufacturing.

Why Choose M1AGL1000V2-FGG144?

The M1AGL1000V2-FGG144 positions itself as a capable FPGA option for commercial applications that require substantial programmable logic, embedded memory, and a high I/O count in a compact BGA package. Its specified supply voltage range and commercial temperature rating make it suitable for mainstream electronic product designs where on-board reconfigurable logic is needed.

For design teams and procurement managers, this device offers a balance of integration and predictable hardware resources that simplifies architecture decisions and supports scalable development flows.

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