M1AGL1000V2-FG256I

IC FPGA 177 I/O 256FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 177 147456 24576 256-LBGA

Quantity 1,057 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-LBGANumber of I/O177Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M1AGL1000V2-FG256I – IGLOO Field Programmable Gate Array (FPGA) IC 177 147456 24576 256-LBGA

The M1AGL1000V2-FG256I is an IGLOO flash-based FPGA device optimized for low-power, reprogrammable system designs. It combines flash nonvolatile configuration with FPGA fabric capacity—delivering 24,576 logic elements, approximately 144 Kbits of embedded RAM, and up to 1,000,000 system gates—targeting industrial and embedded applications that require a balance of integration, low standby power, and on-chip processing capability.

As an ARM-enabled M1 IGLOO device, this part supports implementation of the 32-bit Cortex-M1 soft processor inside the FPGA fabric and includes Microchip’s low-power features such as Flash*Freeze and Low Power Active modes for ultra-low standby consumption.

Key Features

  • Logic Capacity  Provides 24,576 logic elements (reported as logic element cells) and approximately 1,000,000 system gates to support mid- to high-density FPGA implementations.
  • Embedded Memory  Includes 147,456 total RAM bits (approximately 144 Kbits) of true dual-port SRAM for on-chip data storage and buffering.
  • I/O and Package  Offers 177 user I/Os in a 256-LBGA package (supplier package: 256-FPBGA, 17 × 17 mm) for flexible board integration and high pin-count connectivity.
  • Low-Power Operation  Flash*Freeze ultra-low power mode (as low as 5 μW) and Low Power Active capability (from 12 μW) enable minimal standby consumption while retaining FPGA state.
  • Reprogrammable Flash Technology  Flash-based configuration provides instant-on behavior and nonvolatile retention of programmed designs across power cycles, with on-chip reprogrammable FlashROM available.
  • ARM Cortex‑M1 Support  M1 IGLOO devices support the 32-bit Cortex‑M1 soft processor implemented in the FPGA fabric; note ARM-enabled devices with ordering numbers beginning with M1AGL do not support on-chip AES decryption.
  • Clocking and Performance  Integrated clock conditioning circuitry and PLL-based clock management are provided by IGLOO architecture to support system clocking requirements.
  • Voltage and Temperature  Core/I/O voltage support includes a supply range of 1.14 V to 1.575 V and core-level support for 1.2 V to 1.5 V; rated for industrial temperature operation from −40 °C to 85 °C.
  • Security and In-System Programming  IGLOO family supports in-system programming (ISP) and features designed security mechanisms for protecting FPGA contents (series-level capabilities described in datasheet).

Typical Applications

  • Industrial Control  Used for control logic, sensor interfacing, and real-time processing in industrial systems where industrial temperature range and low-power standby are required.
  • Portable and Battery-Powered Equipment  Low standby power modes and instant-on flash configuration make this device suitable for battery-conscious designs that need retained state and rapid recovery.
  • Embedded Processing  Integration of a Cortex‑M1 soft processor in the FPGA fabric supports on-chip control and system management tasks without external processors.
  • Communications and I/O Bridging  High I/O count and mixed-voltage I/O capability enable protocol bridging, interface aggregation, and device-level connectivity in communications equipment.

Unique Advantages

  • Highly Integrated, Nonvolatile Design:  Flash-based configuration stores the programmed design on-chip for instant-on operation and simplifies system boot and security.
  • Low Standby Power:  Flash*Freeze and Low Power Active modes reduce system idle power to micro-watt levels, extending battery life and lowering system energy consumption.
  • On-Chip Processing Option:  Support for the Cortex‑M1 soft processor enables integrated control and application code execution without an external MCU, reducing BOM complexity.
  • Mid-to-High Density Logic:  24,576 logic elements and up to ~1,000,000 system gates provide the capacity to implement substantial custom logic and state machines on a single device.
  • Industrial Temperature Range:  Rated from −40 °C to 85 °C to meet temperature requirements for industrial deployments.
  • Flexible I/O and Packaging:  177 user I/Os in a 256-LBGA (17 × 17 mm) footprint enable dense board-level integration with mixed-voltage support for varied system interfaces.

Why Choose M1AGL1000V2-FG256I?

The M1AGL1000V2-FG256I positions itself as a low-power, flash-configured FPGA solution for designs that require significant logic resources, embedded memory, and flexible I/O in an industrial temperature rating. Its combination of reprogrammable nonvolatile configuration, micro-watt standby modes, and the option to implement a Cortex‑M1 soft processor makes it suitable for embedded systems where both control and custom logic must coexist on a single chip.

This part is well suited to engineers and teams seeking a durable, integrated FPGA platform that balances density and power efficiency while simplifying system architecture and reducing external components.

Request a quote or submit an inquiry to receive pricing, availability, and technical support for the M1AGL1000V2-FG256I. Our team can provide lead-time information and help evaluate this FPGA for your specific design requirements.

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