M1AGL1000V2-FGG256

The M1AGL1000V2-FGG256 is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology. The device provides 24,576 logic elements, approximately 147,456 bits of on-chip RAM, and up to 177 I/Os in a 256-LBGA surface-mount package.

Specified for commercial-grade operation, the part supports a core supply range of 1.14 V to 1.575 V and an operating temperature range of 0 °C to 70 °C, making it suitable for a wide range of embedded and system integration designs that require moderate logic density and flexible I/O counts.

Key Features

• Core Logic — 24,576 logic elements (equivalent to 24,576 logic cells) and approximately 1,000,000 gates provide the programmable fabric for custom digital functions and glue logic.
• Embedded Memory — Approximately 147,456 bits of on-chip RAM for implementing FIFOs, small buffers, and state machines without external memory.
• I/O Capacity — Up to 177 general-purpose I/Os to support multiple peripheral interfaces and board-level connectivity requirements.
• Package & Mounting — Supplied in a 256-LBGA (256-FPBGA, 17 × 17 mm) surface-mount package for compact board footprints and high-density routing.
• Power — Core voltage range of 1.14 V to 1.575 V to match a variety of system power architectures.
• Operating Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C.
• Manufacturer — Designed and produced by Microchip Technology.

Typical Applications

• Embedded Logic and Control — Implement control state machines, protocol bridging, and custom logic using the 24,576 logic elements and on-chip RAM.
• Interface Aggregation — Aggregate multiple interfaces and peripherals using the device’s up to 177 I/Os for board-level system integration.
• Signal Glue and Timing — Replace discrete glue components by consolidating timing, buffering, and simple data-path functions within the FPGA fabric.

Unique Advantages

• Balanced Logic Density: 24,576 logic elements enable substantial programmable functionality while fitting mid-density design requirements.
• On-Chip Memory for Compact Designs: Approximately 147,456 bits of embedded RAM reduces the need for external memory for small buffers and state storage.
• High I/O Count: Up to 177 I/Os allow flexible partitioning of signals and support for multiple interfaces without extensive multiplexing.
• Compact, Industry-Standard Package: 256-LBGA (17 × 17 mm) package enables dense PCB layouts while maintaining surface-mount assembly compatibility.
• Commercial-Grade Availability: Rated for 0 °C to 70 °C operation and specified supply voltage range for consistent behavior in commercial applications.
• Single-Vendor Supply: Manufactured by Microchip Technology, providing a clear source for procurement and lifecycle considerations.

Why Choose M1AGL1000V2-FGG256?

The M1AGL1000V2-FGG256 combines a mid-range logic capacity with ample on-chip RAM and a high I/O count in a compact 256-LBGA package. Its supply voltage range and commercial operating temperature make it a practical choice for embedded systems and board-level integration tasks where predictable digital resources and compact packaging are required.

This IGLOO FPGA is well suited for design teams needing a programmable, vendor-supported solution from Microchip Technology that balances logic density, memory, and I/O in a single device—helping reduce external components and streamline board design and integration.

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