M1AGL1000V2-FGG484I
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 300 147456 24576 484-BGA |
|---|---|
| Quantity | 514 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 300 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M1AGL1000V2-FGG484I – IGLOO Field Programmable Gate Array (FPGA) IC 300 147456 24576 484-BGA
The M1AGL1000V2-FGG484I is an IGLOO field programmable gate array (FPGA) from Microchip Technology. It provides 24,576 logic elements and approximately 0.147 Mbits of embedded memory in a compact 484-ball BGA package for surface-mount assembly.
With 300 user I/O, a 1,000,000-gate equivalent capacity, an industrial operating temperature range, and a low-voltage supply range, this FPGA is suited to designs that require moderate logic density, significant I/O connectivity, and operation across extended temperature conditions.
Key Features
- Core Logic 24,576 logic elements (cells) providing a 1,000,000-gate equivalent implementation for programmable logic functions.
- Embedded Memory 147,456 bits of on-chip RAM (approximately 0.147 Mbits) for local data storage and buffering.
- I/O Capacity 300 user I/O pins to support multi-channel interfacing and flexible board-level connectivity.
- Power Supply Operates from a nominal supply range of 1.14 V to 1.575 V, enabling integration with low-voltage systems.
- Package & Mounting 484-ball FPBGA (23 × 23) package, surface-mount compatible for high-density PCB designs.
- Temperature Grade Industrial-grade operation from −40 °C to 85 °C for deployment in temperature-challenging environments.
- Mounting Type & Reliability Surface mount BGA package designed for reliable soldered connections in production assemblies.
- RoHS Compliance RoHS-compliant manufacturing status for environmental and regulatory alignment.
Typical Applications
- Industrial Control The industrial temperature range (−40 °C to 85 °C) and 300 I/O make it suitable for control and interface functions in factory automation and process equipment.
- Embedded Systems Moderate logic density and on-chip RAM support custom embedded logic, protocol bridging, and peripheral aggregation in embedded controllers.
- Communications & Networking High I/O count and significant gate capacity enable packet handling, protocol adaptation, or glue logic for communication modules.
Unique Advantages
- High Logic Density: 24,576 logic elements provide substantial programmable resources for complex logic implementations without immediate need for external ASICs.
- Integrated Memory: Approximately 0.147 Mbits of embedded RAM enables local buffering and state storage close to logic functions.
- Generous I/O Count: 300 user I/O pins allow support for multiple interfaces and parallel connections, simplifying board-level routing.
- Industrial Temperature Support: Rated from −40 °C to 85 °C for deployments requiring extended temperature resilience.
- Compact BGA Package: 484-ball FPBGA (23×23) offers a balance of pin count and PCB area for space-constrained designs.
- Low-Voltage Operation: A supply range of 1.14 V to 1.575 V enables compatibility with modern low-voltage power domains.
Why Choose M1AGL1000V2-FGG484I?
The M1AGL1000V2-FGG484I positions itself as a mid-density, industrial-grade FPGA option that combines sizable programmable logic, embedded RAM, and a high number of I/O in a compact surface-mount BGA package. Its voltage and temperature specifications make it suitable for designs that require low-voltage operation and reliable performance across extended temperature ranges.
This FPGA is well suited to engineers and procurement teams designing industrial control, embedded systems, and communication interfaces that need a balance of logic capacity, on-chip memory, and I/O connectivity while maintaining RoHS compliance and BGA packaging for production-scale assembly.
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