M1AGL1000V2-FGG256I
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 177 147456 24576 256-LBGA |
|---|---|
| Quantity | 1,375 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 177 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M1AGL1000V2-FGG256I – IGLOO Field Programmable Gate Array (FPGA) IC 177 147456 24576 256-LBGA
The M1AGL1000V2-FGG256I is an IGLOO family flash-based FPGA in a 256-LBGA package, offering reprogrammable single-chip FPGA capability with an embedded soft-processor option. Designed for low-power, high-density embedded systems, it combines approximately 24,576 logic elements and roughly 147,456 bits of on-chip RAM with 177 user I/Os to address control, signal processing, and system-management tasks.
Built on IGLOO low-power flash technology, this device targets applications that require low standby power, instant-on behavior, and industrial temperature operation while providing a compact surface-mount package and scalable logic capacity.
Key Features
- Logic Capacity Approximately 24,576 logic elements (24,576 CLBs) and up to 1,000,000 system gates provide substantial programmable logic for medium- to high-density designs.
- Embedded Memory Approximately 147,456 bits (≈144 kbits) of on-chip RAM suitable for buffering, state storage, and small data structures.
- I/O and Voltage Flexibility 177 user I/Os with family-level support for mixed-voltage operation and bank-selectable I/O voltages, enabling interfacing with a wide range of peripherals and voltage domains.
- Low-Power Architecture IGLOO family features such as Flash*Freeze and Low Power Active operation are part of the family specification to minimize standby and active power consumption.
- Embedded Processor Support M1 IGLOO devices support the Cortex‑M1 soft processor; ARM-enabled devices in this family (ordering codes beginning with M1AGL) do not include on-chip AES decryption.
- Package and Mounting 256-LBGA (supplier package: 256-FPBGA 17×17) in a surface-mount form factor for compact board-level integration.
- Voltage and Temperature Core supply range 1.14 V to 1.575 V and industrial operating temperature range −40 °C to 85 °C for deployment in demanding ambient conditions.
- Reprogrammable Flash-Based Technology Flash-based nonvolatile configuration provides instant-on capability and retains programmed design when powered off (family characteristic).
Typical Applications
- Embedded Control and Management Use the on-chip logic and embedded memory to implement system controllers, power-management sequencers, and device supervision functions operating across industrial temperature ranges.
- Low-Power Instrumentation Leverage IGLOO family low-power modes and Flash*Freeze capability to build battery-operated or energy-sensitive instruments that require retained state with minimal standby current.
- Compact System Integration The 256-LBGA surface-mount package and mixed-voltage I/O support enable dense board-level implementations where size and heterogeneous interface voltages are constraints.
- Soft-Processor-Based Designs Deploy the Cortex‑M1 soft processor (supported by M1 IGLOO devices) for embedded application code, interrupt handling, and control tasks implemented directly in the FPGA fabric.
Unique Advantages
- Reprogrammable Nonvolatile Fabric: Retains programmed design when powered off, simplifying field updates and enabling instant-on system behavior.
- Significant Logic and Memory in a Compact Package: Combines ~24,576 logic elements and ~147 kbits of embedded RAM in a 256-LBGA to reduce the need for external components.
- Industrial Temperature Rating: −40 °C to 85 °C operation supports deployment in industrial and outdoor environments where extended temperature range is required.
- Low-Voltage Core Support: Core supply from 1.14 V to 1.575 V enables low-power core operation and design flexibility for modern power-optimized systems.
- Family-Level Low-Power Features: IGLOO Flash*Freeze and Low Power Active modes minimize standby and idle power consumption for energy-sensitive applications.
Why Choose M1AGL1000V2-FGG256I?
The M1AGL1000V2-FGG256I positions itself as a versatile, low-power FPGA solution for embedded designs that require a balance of logic capacity, on-chip memory, and I/O flexibility in a compact industrial-grade package. Its flash-based, reprogrammable architecture provides nonvolatile configuration and instant-on behavior, while the family-level low-power features support energy-efficient system design.
This device is suitable for developers building medium- to high-density embedded systems, low-power instruments, or compact control solutions that benefit from integrated logic, SRAM, and a soft-processor option within a 256-LBGA surface-mount footprint.
Request a quote or submit an inquiry to evaluate M1AGL1000V2-FGG256I for your design and to get lead-time and pricing information tailored to your project requirements.

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