M1AGL1000V2-FGG256I

IC FPGA 177 I/O 256FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 177 147456 24576 256-LBGA

Quantity 1,375 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-LBGANumber of I/O177Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M1AGL1000V2-FGG256I – IGLOO Field Programmable Gate Array (FPGA) IC 177 147456 24576 256-LBGA

The M1AGL1000V2-FGG256I is an IGLOO family flash-based FPGA in a 256-LBGA package, offering reprogrammable single-chip FPGA capability with an embedded soft-processor option. Designed for low-power, high-density embedded systems, it combines approximately 24,576 logic elements and roughly 147,456 bits of on-chip RAM with 177 user I/Os to address control, signal processing, and system-management tasks.

Built on IGLOO low-power flash technology, this device targets applications that require low standby power, instant-on behavior, and industrial temperature operation while providing a compact surface-mount package and scalable logic capacity.

Key Features

  • Logic Capacity  Approximately 24,576 logic elements (24,576 CLBs) and up to 1,000,000 system gates provide substantial programmable logic for medium- to high-density designs.
  • Embedded Memory  Approximately 147,456 bits (≈144 kbits) of on-chip RAM suitable for buffering, state storage, and small data structures.
  • I/O and Voltage Flexibility  177 user I/Os with family-level support for mixed-voltage operation and bank-selectable I/O voltages, enabling interfacing with a wide range of peripherals and voltage domains.
  • Low-Power Architecture  IGLOO family features such as Flash*Freeze and Low Power Active operation are part of the family specification to minimize standby and active power consumption.
  • Embedded Processor Support  M1 IGLOO devices support the Cortex‑M1 soft processor; ARM-enabled devices in this family (ordering codes beginning with M1AGL) do not include on-chip AES decryption.
  • Package and Mounting  256-LBGA (supplier package: 256-FPBGA 17×17) in a surface-mount form factor for compact board-level integration.
  • Voltage and Temperature  Core supply range 1.14 V to 1.575 V and industrial operating temperature range −40 °C to 85 °C for deployment in demanding ambient conditions.
  • Reprogrammable Flash-Based Technology  Flash-based nonvolatile configuration provides instant-on capability and retains programmed design when powered off (family characteristic).

Typical Applications

  • Embedded Control and Management  Use the on-chip logic and embedded memory to implement system controllers, power-management sequencers, and device supervision functions operating across industrial temperature ranges.
  • Low-Power Instrumentation  Leverage IGLOO family low-power modes and Flash*Freeze capability to build battery-operated or energy-sensitive instruments that require retained state with minimal standby current.
  • Compact System Integration  The 256-LBGA surface-mount package and mixed-voltage I/O support enable dense board-level implementations where size and heterogeneous interface voltages are constraints.
  • Soft-Processor-Based Designs  Deploy the Cortex‑M1 soft processor (supported by M1 IGLOO devices) for embedded application code, interrupt handling, and control tasks implemented directly in the FPGA fabric.

Unique Advantages

  • Reprogrammable Nonvolatile Fabric: Retains programmed design when powered off, simplifying field updates and enabling instant-on system behavior.
  • Significant Logic and Memory in a Compact Package: Combines ~24,576 logic elements and ~147 kbits of embedded RAM in a 256-LBGA to reduce the need for external components.
  • Industrial Temperature Rating: −40 °C to 85 °C operation supports deployment in industrial and outdoor environments where extended temperature range is required.
  • Low-Voltage Core Support: Core supply from 1.14 V to 1.575 V enables low-power core operation and design flexibility for modern power-optimized systems.
  • Family-Level Low-Power Features: IGLOO Flash*Freeze and Low Power Active modes minimize standby and idle power consumption for energy-sensitive applications.

Why Choose M1AGL1000V2-FGG256I?

The M1AGL1000V2-FGG256I positions itself as a versatile, low-power FPGA solution for embedded designs that require a balance of logic capacity, on-chip memory, and I/O flexibility in a compact industrial-grade package. Its flash-based, reprogrammable architecture provides nonvolatile configuration and instant-on behavior, while the family-level low-power features support energy-efficient system design.

This device is suitable for developers building medium- to high-density embedded systems, low-power instruments, or compact control solutions that benefit from integrated logic, SRAM, and a soft-processor option within a 256-LBGA surface-mount footprint.

Request a quote or submit an inquiry to evaluate M1AGL1000V2-FGG256I for your design and to get lead-time and pricing information tailored to your project requirements.

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