M1AGL1000V2-FGG484
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 300 147456 24576 484-BGA |
|---|---|
| Quantity | 840 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 300 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M1AGL1000V2-FGG484 – IGLOO Field Programmable Gate Array (FPGA) IC 300 147456 24576 484-BGA
The M1AGL1000V2-FGG484 is an IGLOO family field programmable gate array (FPGA) offered in a 484-ball BGA package. It delivers a mid-range programmable-logic resource set including 24,576 logic elements, approximately 0.147 Mbits of embedded memory, and up to 300 I/O signals.
Designed for commercial-grade applications, this surface-mount FPGA operates on a core supply range of 1.14 V to 1.575 V and supports an operating temperature range of 0 °C to 70 °C, making it suitable for a wide variety of commercial systems that require flexible logic integration and significant I/O capacity.
Key Features
- Core Logic: 24,576 logic elements (cells) providing a substantial resource pool for custom digital logic implementations.
- Embedded Memory: Approximately 0.147 Mbits of on-chip RAM for buffering, state storage, and local data processing.
- I/O Capacity: Up to 300 I/O pins to support broad interfacing and connectivity requirements in compact designs.
- Gate Equivalence: Approximately 1,000,000 gates for estimating overall design complexity and partitioning.
- Package & Mounting: 484-ball BGA (484-FPBGA, 23 × 23 mm footprint) in a surface-mount package for high-density board-level integration.
- Power Supply: Core voltage range from 1.14 V to 1.575 V to match common low-voltage FPGA power domains.
- Commercial Temperature Grade: Rated for 0 °C to 70 °C operation suitable for commercial electronic products.
- RoHS Compliant: Meets RoHS environmental requirements for lead-free manufacturing.
Typical Applications
- Commercial Embedded Systems: Implement custom logic and control functions where 24,576 logic elements and on-chip RAM support system-level integration.
- Interface and I/O Aggregation: Use the device to bridge and manage multiple external interfaces, leveraging up to 300 I/O signals for connectivity.
- Prototyping and Custom Logic: Deploy as a programmable platform for proof-of-concept designs and customized digital implementations in commercial products.
Unique Advantages
- High Logic Density: 24,576 logic elements enable implementation of complex custom logic without external CPLDs or large ASICs.
- Significant On-Chip Memory: Approximately 0.147 Mbits of embedded RAM reduces dependence on external memory for small to moderate buffering and state storage needs.
- Extensive I/O Count: Up to 300 I/O pins provide flexibility for multi-interface designs and signal routing on compact PCBs.
- Compact BGA Package: 484-FPBGA (23 × 23 mm) offers a space-efficient footprint for high-density board layouts.
- Commercial-Grade Reliability: Rated for 0 °C to 70 °C operation and RoHS compliance for mainstream commercial product requirements.
- Flexible Power Domain: Core voltage support from 1.14 V to 1.575 V accommodates common low-voltage system designs.
Why Choose M1AGL1000V2-FGG484?
The M1AGL1000V2-FGG484 positions itself as a commercially graded FPGA solution that balances logic capacity, embedded memory, and high I/O count in a compact BGA footprint. Its combination of 24,576 logic elements, approximately 0.147 Mbits of on-chip RAM, and up to 300 I/O signals makes it well suited to designers who need substantial programmable logic and interface density without moving to larger form-factor devices.
For teams designing commercial electronic products that require scalable, programmable logic, this IGLOO FPGA offers a practical mix of integration and flexibility while supporting common low-voltage supplies and surface-mount board assembly. It is suited to projects where mid-range gate capacity and extensive I/O are priorities and where RoHS compliance is required.
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