M1AGL600V5-FGG144I

IC FPGA 97 I/O 144FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 97 110592 13824 144-LBGA

Quantity 1,244 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1AGL600V5-FGG144I – IGLOO Field Programmable Gate Array, 97 I/Os, 13,824 Logic Elements, 144-LBGA

The M1AGL600V5-FGG144I is a Microchip Technology IGLOO flash-based FPGA supplied in a 144-LBGA package. It is part of the IGLOO low-power flash FPGA family and is delivered as an ARM-enabled M1 IGLOO device.

Designed for low-power, reprogrammable logic integration, this device targets applications that require on-chip nonvolatile configuration, moderate logic capacity, and mixed-voltage I/O support. Key value propositions include low standby and active power modes, integrated flash nonvolatile storage, and support for a Cortex‑M1 soft processor in the M1-enabled device family.

Key Features

  • Logic Capacity — 13,824 logic elements (cells) and approximately 600,000 system gates for mid-range logic integration.
  • Embedded Memory — 110,592 bits of on-chip RAM (approximately 110.6 kbits) for data buffering and state storage.
  • I/O and Voltage — 97 user I/Os with mixed-voltage support; device supply range specified at 1.425 V to 1.575 V for core operation.
  • Low-Power Operation — Flash*Freeze ultra-low-power mode consuming as little as 5 μW and Low Power Active capability (static idle) from 12 μW, enabling power-managed operation while retaining fabric state.
  • Reprogrammable Flash Technology — Flash-based, nonvolatile configuration that retains programmed designs when powered off and supports instant-on behavior at system power-up.
  • ARM M1 Soft-Processor Support — As an M1 IGLOO device family member, the platform supports the Cortex‑M1 soft processor implementation in the FPGA fabric.
  • Package and Mounting — 144-LBGA (144-FPBGA, 13 × 13), surface-mount package suitable for compact board designs.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 85 °C and RoHS compliant.
  • In-System Programming and Security — IGLOO family supports in-system programming and FlashLock security features (series-level capability).

Typical Applications

  • Power-Sensitive Embedded Systems — Use Flash*Freeze and Low Power Active modes to manage system power while maintaining configuration and state in low-power conditions.
  • Instant-On Control Electronics — Nonvolatile flash configuration enables immediate availability after power-up for control and monitoring tasks.
  • Soft-Processor Systems — Implement a Cortex‑M1 soft processor in the FPGA fabric for embedded control, sequencing, or supervisory functions.
  • Mid-Density Logic Integration — Integrate up to 13,824 logic elements and on-chip RAM for consolidated glue logic, protocol handling, or peripheral aggregation.

Unique Advantages

  • Low Standby and Active Power: Flash*Freeze mode (as low as 5 μW) and Low Power Active operation reduce system power draw while preserving FPGA contents and functionality.
  • Nonvolatile, Reprogrammable Configuration: Flash-based configuration retains designs when power is removed and enables instant-on operation, simplifying system bring-up.
  • Embedded Processor Capability: M1 family support for the Cortex‑M1 soft processor lets you consolidate control software into the FPGA fabric without external CPUs.
  • Balanced Logic and Memory: 13,824 logic elements paired with 110,592 bits of embedded RAM provide a balance of combinatorial logic and storage for mid-range designs.
  • Industrial Temperature and RoHS Compliance: −40 °C to 85 °C rating and RoHS compliance meet common industrial deployment requirements.
  • Compact Packaging: 144-LBGA (13 × 13) surface-mount package supports dense board layouts while providing ample I/O count.

Why Choose M1AGL600V5-FGG144I?

The M1AGL600V5-FGG144I positions itself as a low-power, nonvolatile FPGA solution for designers needing mid-range logic capacity with embedded memory and a compact package. Its flash-based architecture and Flash*Freeze low-power capabilities make it suited to systems that require retained configuration, instant-on behavior, and the ability to manage power dynamically.

This device is appropriate for engineers consolidating control functions, implementing a soft Cortex‑M1 processor, or reducing external component count in industrial-temperature applications. Its combination of logic density, on-chip RAM, and mixed-voltage I/O support offers long-term design flexibility within the IGLOO low-power FPGA family.

Request a quote or submit a sales inquiry to evaluate M1AGL600V5-FGG144I for your next low-power, mid-density FPGA design.

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