M1AGL600V5-FGG256I

The M1AGL600V5-FGG256I is an IGLOO field programmable gate array (FPGA) packaged in a 256-ball LBGA/FPBGA (17×17) surface-mount package. It provides a balanced resource set including 13,824 logic elements, approximately 0.11 Mbits of embedded RAM, up to 177 I/O pins and a 600,000-gate equivalent capacity.

Designed with a 1.425 V to 1.575 V core supply range and an industrial operating temperature range (–40 °C to 85 °C), this device addresses designs that require moderate density logic, on-chip memory and substantial I/O in a compact, RoHS-compliant package.

Key Features

• Core Logic 13,824 logic elements providing a 600,000-gate equivalent resource for implementing custom digital functions and control logic.
• Embedded Memory Approximately 110,592 bits of on-chip RAM (about 0.11 Mbits) for distributed storage and buffering within the FPGA fabric.
• I/O Capacity Up to 177 I/O pins to support diverse peripheral and interface requirements.
• Power Supply Core voltage supply range of 1.425 V to 1.575 V to match system power rails and device requirements.
• Package & Mounting 256-ball FPBGA (17×17) / 256-LBGA package in a surface-mount form factor for high-density board designs.
• Operating Range Industrial-grade operation from –40 °C to 85 °C for deployment in temperature-sensitive environments.
• Regulatory RoHS-compliant, meeting lead-free and restricted-substances requirements for modern manufacturing.

Typical Applications

• Industrial Control — Use the device where industrial temperature range and substantial I/O count are required for control logic, signal aggregation and interface consolidation.
• Embedded System Integration — Implement custom glue logic, protocol bridging and peripheral management leveraging 13,824 logic elements and on-chip RAM.
• I/O-Intensive Designs — Deploy in systems that need many external connections, benefiting from up to 177 I/O pins in a compact BGA package.

Unique Advantages

• Well-balanced resource set: 13,824 logic elements combined with 110,592 bits of embedded RAM provide a practical mix of logic and memory for mid-density designs.
• High I/O density: 177 available I/Os simplify board-level routing and reduce the need for external I/O expanders.
• Industrial temperature capability: Specified operation from –40 °C to 85 °C supports deployment in harsher ambient conditions.
• Compact surface-mount package: 256-FPBGA (17×17) enables space-efficient layouts for compact or densely populated PCBs.
• RoHS compliant: Aligns with modern manufacturing and environmental requirements.
• Defined core voltage range: 1.425 V to 1.575 V core supply simplifies power sequencing and integration with system power rails.

Why Choose M1AGL600V5-FGG256I?

The M1AGL600V5-FGG256I positions itself as a practical mid-density FPGA option that couples a substantial logic element count and on-chip memory with a high I/O count and an industrial temperature rating. Its 256-ball BGA footprint and surface-mount construction make it suitable for compact, production-oriented PCBs where board space and connectivity are priorities.

This device is well suited to designers seeking a durable, RoHS-compliant FPGA with clear, verifiable resources—logic elements, embedded RAM, gate equivalent and I/O capacity—backed by an industrial operating range and defined core voltage requirements.

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