M1AGLE3000V2-FGG484

The M1AGLE3000V2-FGG484 is an IGLOOe Field Programmable Gate Array (FPGA) IC from Microchip Technology built in a 484-BGA package. It provides a balance of logic density, on-chip memory and I/O capacity for commercial-grade embedded designs.

With 75,264 logic elements, 341 general-purpose I/Os and approximately 0.52 Mbits of embedded RAM, this FPGA is targeted at designs that require substantial programmable logic and a high pin count within a compact surface-mount BGA footprint.

Key Features

• Logic Capacity  75,264 logic elements supporting complex programmable logic implementations and up to 3,000,000 equivalent gates for mid-to-high density designs.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM available for local storage, buffering and state retention within logic functions.
• I/O Density  341 I/Os to support diverse peripheral interfacing and multi-channel connectivity on a single device.
• Power Supply Range  Flexible core voltage operation from 1.14 V to 1.575 V to match system power-rail requirements.
• Package and Mounting  484-BGA (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact PCB integration.
• Operating Grade  Commercial grade with an operating temperature range of 0 °C to 70 °C for standard ambient environments.
• Environmental Compliance  RoHS compliant for regulatory and environmental considerations in commercial products.

Typical Applications

• Embedded control and logic consolidation  Use the FPGA’s logic density and on-chip RAM to implement control algorithms, state machines and custom compute blocks within commercial embedded systems.
• High-density I/O bridging  Leverage 341 I/Os to connect multiple peripherals or act as a protocol bridge between subsystems on a single board.
• Compact board-level integration  The 484-BGA surface-mount package enables space-efficient designs where a high pin count and compact footprint are required.
• Prototyping and development  Suitable for developing and validating mid-to-high complexity FPGA designs that require substantial logic and I/O resources under commercial conditions.

Unique Advantages

• High logic density: 75,264 logic elements and ~3,000,000 gates provide the capacity to implement complex custom logic and integration into a single device.
• Significant I/O count: 341 I/Os simplify system-level routing by consolidating multiple peripheral interfaces to one FPGA.
• Compact BGA packaging: 484-FPBGA (23×23) surface-mount package reduces PCB footprint while maintaining high connectivity.
• On-chip memory: Approximately 0.52 Mbits of embedded RAM supports buffering, local data storage and state retention without external memory.
• Commercial temperature and RoHS compliance: Designed for 0 °C to 70 °C operation and RoHS conformance to meet common commercial product requirements.
• Flexible core voltage: 1.14 V to 1.575 V supply range accommodates a variety of board-level power strategies.

Why Choose M1AGLE3000V2-FGG484?

The M1AGLE3000V2-FGG484 delivers a balanced combination of logic capacity, embedded memory and a very high I/O count in a compact 484-BGA package, making it a practical choice for commercial embedded designs that require significant programmable logic and board-level integration. Manufactured by Microchip Technology, it aligns with typical commercial operating environments and RoHS requirements.

This FPGA is well suited to designers and teams building mid-to-high complexity systems that need consolidated logic, dense peripheral connectivity and a compact surface-mount solution. Its specified voltage range, thermal rating and package make it straightforward to integrate into standard commercial product workflows.

Request a quote or submit an inquiry to receive pricing and availability for the M1AGLE3000V2-FGG484 and to discuss how it can fit into your next design.