M1AGLE3000V5-FG484

IC FPGA 341 I/O 484FBGA
Part Description

IGLOOe Field Programmable Gate Array (FPGA) IC 341 516096 75264 484-BGA

Quantity 751 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BGANumber of I/O341Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of M1AGLE3000V5-FG484 – IGLOOe Field Programmable Gate Array (FPGA) 484-BGA

The M1AGLE3000V5-FG484 is an IGLOOe field programmable gate array (FPGA) offered in a 484-ball BGA package for commercial electronic designs. It provides a combination of logic density, embedded memory, and I/O capacity suitable for programmable logic integration in a wide range of commercial applications.

With 75,264 logic elements, approximately 0.516 Mbits of embedded memory, up to 341 I/O pins and a 3,000,000-gate equivalent, this device targets designs that require substantial on-chip logic and interfacing capability while operating within a 1.425 V to 1.575 V supply range and a 0 °C to 70 °C commercial temperature window.

Key Features

  • Core Logic 75,264 logic elements providing a large programmable fabric for combinational and sequential logic implementation.
  • Embedded Memory Approximately 0.516 Mbits of on-chip RAM for data buffering, state storage and small lookup tables.
  • Gate Capacity Equivalent to 3,000,000 gates for implementing complex designs and integrating multiple functions on a single device.
  • I/O Capability Up to 341 I/O pins to support broad interfacing requirements and multiple parallel connections.
  • Power Operates from a core supply voltage range of 1.425 V to 1.575 V, enabling defined power domain planning in your system design.
  • Package 484-ball BGA in a 484-FPBGA (23×23) footprint for compact board-level integration and reliable solder attachment.
  • Grade and Temperature Commercial grade device specified for operation from 0 °C to 70 °C.
  • RoHS Compliant Conforms to RoHS environmental requirements for restricted substance content.

Typical Applications

  • Commercial Embedded Systems — Programmable logic integration in commercial electronic products requiring substantial logic capacity and multiple I/O connections.
  • I/O-Intensive Designs — Systems that need many interfaces or parallel signal handling can leverage the device’s 341 I/O pins for flexible connectivity.
  • On-Chip Data Buffering — Designs that require localized memory for buffering or small data stores can use the approximately 0.516 Mbits of embedded RAM.
  • Complex Control Logic — Implement state machines, custom control paths or merged logic blocks using the device’s 75,264 logic elements and 3,000,000-gate capacity.

Unique Advantages

  • Substantial Logic Density: 75,264 logic elements enable consolidation of multiple functions into a single programmable device, reducing board-level component count.
  • Significant Gate Equivalent: A 3,000,000-gate capacity accommodates complex designs and feature-rich implementations without external ASICs.
  • High I/O Count: Up to 341 I/O pins simplify system interface design and reduce the need for external expanders.
  • Compact BGA Package: 484-ball (23×23) FPBGA footprint supports high-density PCB layouts and reliable solder connections in space-constrained designs.
  • Commercial Temperature Range: Rated for 0 °C to 70 °C operation to match typical commercial product environments.
  • RoHS Compliance: Supports environmental regulatory requirements for restricted substance use.

Why Choose M1AGLE3000V5-FG484?

The M1AGLE3000V5-FG484 positions itself as a high-density IGLOOe FPGA option for commercial designs that require a balance of logic capacity, embedded memory and extensive I/O. Its combination of 75,264 logic elements, approximately 0.516 Mbits of on-chip RAM and a 341-pin I/O footprint provides a capable platform for consolidating digital functions and simplifying board-level integration.

This device is suitable for design teams looking for a programmable solution that aligns with commercial temperature and RoHS requirements while offering a compact 484-BGA package and a defined core voltage window for system power planning. It offers a straightforward path to scale and integrate complex logic in commercial electronic products.

Request a quote or submit a procurement inquiry to get pricing and lead-time information for the M1AGLE3000V5-FG484.

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