M1AGLE3000V5-FGG484I

IC FPGA 341 I/O 484FBGA
Part Description

IGLOOe Field Programmable Gate Array (FPGA) IC 341 516096 75264 484-BGA

Quantity 856 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BGANumber of I/O341Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of M1AGLE3000V5-FGG484I – IGLOOe FPGA, 75,264 Logic Elements, 484-BGA

The M1AGLE3000V5-FGG484I is an IGLOOe field programmable gate array (FPGA) from Microchip Technology designed to deliver high-density programmable logic and I/O integration in a compact BGA package. It combines 75,264 logic elements with approximately 0.52 Mbits of embedded memory and up to 341 I/O pins to address industrial designs that require substantial on-chip logic and connectivity.

With an operating voltage range of 1.425 V to 1.575 V, industrial-grade (-40 °C to 85 °C) qualification, and a 484-ball FPBGA (23×23) package, this device targets systems that demand reliable operation in temperature-constrained environments while maintaining a small board footprint.

Key Features

  • Core Logic  75,264 logic elements (LEs) providing a large resource pool for custom digital logic and system integration.
  • On-Chip Memory  Approximately 0.52 Mbits of embedded RAM (516,096 bits) to support buffering, FIFOs, and local data storage close to logic.
  • Gate Count  Around 3,000,000 gates available to implement complex digital functions and state machines.
  • I/O Capacity  341 general-purpose I/O pins for wide external connectivity and interface aggregation.
  • Power  Narrow core voltage supply range of 1.425 V to 1.575 V to meet defined power sequencing and supply specifications.
  • Package  484-ball FPBGA (23×23) package, listed as 484-BGA, for high-density, surface-mount PCB integration.
  • Temperature & Grade  Industrial grade with an operating temperature range of -40 °C to 85 °C for robust field deployment.
  • RoHS Compliance  RoHS compliant for environmentally regulated manufacturing.

Typical Applications

  • Industrial Control & Automation  Industrial-grade temperature rating and a high logic/I/O count make this FPGA suitable for control systems and automation equipment requiring reliable operation across a wide ambient range.
  • I/O-Intensive Systems  With 341 I/O pins, the device supports applications that need extensive external interfacing, signal aggregation, or protocol bridging.
  • Custom Digital Processing  Large logic resources and a multi-million-gate capacity enable implementation of bespoke signal processing, state machines, and control logic on-chip.

Unique Advantages

  • High Logic Density: 75,264 logic elements allow consolidation of multiple functions into a single FPGA, reducing system complexity and BOM.
  • Compact, High-Pin Package: The 484-FPBGA (23×23) package delivers a high I/O count in a compact footprint for space-constrained PCBs.
  • Industrial Reliability: Rated for -40 °C to 85 °C and classified as industrial grade for dependable operation in demanding environments.
  • Integrated Memory: Approximately 0.52 Mbits of on-chip RAM reduces dependence on external memory for common buffering and control tasks.
  • Defined Power Envelope: The specified 1.425 V to 1.575 V supply range supports predictable power design and voltage sequencing.
  • Environmental Compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose M1AGLE3000V5-FGG484I?

The M1AGLE3000V5-FGG484I positions itself as a robust IGLOOe FPGA option for engineers needing significant on-chip logic, memory, and I/O in an industrial-grade package. Its combination of 75,264 logic elements, approximately 0.52 Mbits of embedded memory, and 341 I/Os in a 484-FPBGA footprint makes it well suited for compact, connectivity-rich designs that must operate reliably from -40 °C to 85 °C.

Backed by Microchip Technology, this device offers a balance of integration and environmental compatibility to support long-term deployment in industrial systems where board space, I/O count, and temperature resilience are primary concerns.

Request a quote or submit a pricing inquiry to receive availability and purchasing information for the M1AGLE3000V5-FGG484I.

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