M1AGLE3000V5-FGG484

The M1AGLE3000V5-FGG484 is an IGLOOe field programmable gate array (FPGA) from Microchip Technology, offered in a 484-ball BGA package. It provides a high logic-element count and substantial I/O capacity in a compact surface-mount package for commercial-temperature embedded designs.

With 75,264 logic elements, approximately 0.52 Mbits of embedded memory, and 341 I/O pins, this device targets applications that require significant on-chip logic, memory buffering, and interface density while operating from a well-defined core voltage range.

Key Features

• Logic Capacity  75,264 logic elements (cells) provide programmable resources for complex custom logic and control functions.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM (516,096 bits) for data buffering, FIFOs, and small working memory requirements.
• I/O Density  341 general-purpose I/O pins enable broad interfacing to sensors, peripherals, and external devices.
• Gate Equivalent  Approximately 3,000,000 gates for sizing and partitioning medium- to high-complexity designs.
• Power and Core Voltage  Specified core supply voltage from 1.425 V to 1.575 V for defined power-domain design and supply planning.
• Package & Mounting  484-BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for board-level integration in space-constrained layouts.
• Operating Range  Commercial operating temperature range of 0 °C to 70 °C suitable for standard consumer and commercial environments.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Embedded Control & Signal Processing  Use on-chip logic and embedded memory to implement custom control algorithms, signal processing blocks, and state machines.
• High-Density I/O Interfaces  Aggregate sensors, peripherals, or multiple serial/parallel interfaces using the device’s 341 I/O pins for board-level protocol bridging and glue logic.
• Prototyping and Development  Leverage the sizeable logic and gate resources to prototype complex digital designs prior to ASIC implementation or system integration.
• Compact Systems  Deploy in space-constrained electronics where a BGA package and surface-mount assembly are required for board real estate optimization.

Unique Advantages

• High Logic Density: 75,264 logic elements enable substantial on-chip computation and custom logic integration, reducing the need for external CPLDs or FPGAs.
• Integrated Memory Resources: Approximately 0.52 Mbits of embedded RAM supports buffering and local data storage without additional external memory components.
• Large I/O Count: 341 I/O pins provide flexibility for connecting multiple peripherals and interfaces directly to the FPGA.
• Compact BGA Package: 484-ball FPBGA (23×23) delivers high pin count in a compact footprint for dense PCB designs.
• Defined Voltage Domain: Narrow core supply range (1.425 V–1.575 V) simplifies power-supply design and voltage rail planning.
• Commercial-Grade and RoHS Compliant: Designed for commercial-temperature deployments and compliant with RoHS requirements for regulatory alignment.

Why Choose M1AGLE3000V5-FGG484?

The M1AGLE3000V5-FGG484 positions itself as a capable IGLOOe FPGA option for designers who need a combination of high logic element count, substantial on-chip memory, and a large number of I/O in a compact BGA package. Its specified core voltage range and commercial temperature rating make it suitable for a broad set of consumer and commercial embedded applications.

Choose this Microchip Technology FPGA when your design requires dense programmable logic, local RAM resources, and flexible interfacing in a surface-mount 484-BGA footprint—helping to consolidate system functions and simplify PCB integration.

Request a quote or submit an inquiry to obtain pricing and availability for the M1AGLE3000V5-FGG484 and to discuss how it fits your next FPGA-based design.