M1AGLE3000V2-FG484

The M1AGLE3000V2-FG484 is an IGLOOe field programmable gate array (FPGA) IC from Microchip Technology. It delivers a high-density, reprogrammable logic fabric in a 484-ball BGA package for commercial-grade embedded designs.

With 75,264 logic elements, approximately 0.52 Mbits of embedded memory, and 341 general-purpose I/Os, this device targets applications that require substantial logic capacity, significant I/O count, and compact board-level integration while operating within a 1.14 V to 1.575 V supply range.

Key Features

• Core Logic 75,264 logic elements (cells) provide scalable programmable logic capacity for complex finite-state machines, glue logic, and custom hardware acceleration.
• Embedded Memory Approximately 0.52 Mbits of on-chip RAM (516,096 bits) to support buffering, lookup tables, and small data storage needs without external memory.
• I/O and Gate Count 341 I/O pins and an internal gate count of 3,000,000 support dense peripheral interfacing and sizable logic implementations.
• Power Operates from a core supply range of 1.14 V to 1.575 V to match low-voltage system domains.
• Package and Mounting Supplied in a 484-BGA package (484-FPBGA, 23×23) designed for surface-mount assembly to simplify PCB layout in space-constrained designs.
• Commercial Grade and Temperature Rated for commercial use with an operating temperature range of 0 °C to 70 °C.
• Regulatory RoHS compliant for restriction of hazardous substances in assembly and manufacturing.

Typical Applications

• High‑density I/O systems — 341 I/Os enable flexible interfacing and board-level consolidation where many peripherals or buses must be bridged.
• Custom logic and protocol bridging — 75,264 logic elements and 3,000,000 gates allow implementation of complex protocol translators and glue logic.
• Embedded control and state machines — On-chip RAM (516,096 bits) supports buffering and small data structures for control, monitoring, and sequencing tasks.

Unique Advantages

• High logic density: 75,264 logic elements give room to implement extensive custom logic without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 0.52 Mbits of embedded RAM reduces reliance on external memory for many control and buffering needs.
• Large I/O capacity: 341 I/Os simplify system integration by accommodating multiple peripherals and interfaces directly on the FPGA.
• Compact BGA footprint: 484-BGA (484-FPBGA, 23×23) enables high-density PCB designs while keeping the device surface-mount compatible.
• Low-voltage core: 1.14 V–1.575 V supply range supports integration into modern, low-voltage system architectures.
• Commercial-grade, RoHS compliant: Suitable for mainstream industrial and consumer applications with lead-free manufacturing compatibility.

Why Choose M1AGLE3000V2-FG484?

The M1AGLE3000V2-FG484 combines substantial programmable logic, on-chip memory, and a high I/O count in a compact 484-BGA package, making it well suited for commercial embedded systems that require dense logic integration and flexible interfacing. Backed by Microchip Technology, it provides a clear upgrade path for designs needing increased logic capacity without expanding board footprint.

This device is a practical choice for engineers designing control, protocol bridging, and I/O‑heavy applications who need reliable, reprogrammable logic with on-chip resources and surface-mount package compatibility for efficient production assembly.

Request a quote or submit an inquiry to obtain pricing and availability for the M1AGLE3000V2-FG484.