M1AGL600V5-FGG256

The M1AGL600V5-FGG256 is an IGLOO field programmable gate array (FPGA) from Microchip Technology designed for commercial electronic applications. As a reconfigurable logic device, it provides developers with a flexible platform for implementing custom digital functions, protocol bridging, and I/O aggregation.

Key hardware characteristics include 13,824 logic elements, 177 general-purpose I/Os, approximately 0.11 Mbits of embedded RAM, and a compact 256-LBGA package, enabling integration into space-constrained commercial systems with defined supply and temperature ranges.

Key Features

• Core Logic 13,824 logic elements (logic cells) supporting custom digital designs and complex combinational/sequential logic.
• Embedded Memory Approximately 0.11 Mbits (110,592 bits) of on-chip RAM to support buffers, small lookup tables, and state storage.
• I/O Capacity 177 general-purpose I/Os for interfacing with peripherals, sensors, and external logic devices.
• Gate Count Approximately 600,000 gates for mapping sizeable logic functions within the device.
• Package 256-LBGA package (supplier device package: 256-FPBGA, 17×17) optimized for surface-mount assembly in compact boards.
• Power Supply Operates from a defined core voltage range of 1.425 V to 1.575 V for predictable power design.
• Temperature and Grade Commercial-grade device rated for 0 °C to 70 °C operating temperature.
• Compliance RoHS compliant to support lead-free and environmentally conscious designs.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, I/O management, and data handling in commercial electronics within the device's 0 °C to 70 °C operating range.
• Prototyping and Development — Reconfigurable logic resources and on-chip RAM make the device suitable for proof-of-concept designs and iterative development.
• Protocol Bridging and Glue Logic — High I/O count and flexible logic capacity support interfacing between disparate peripherals and logic domains.
• Compact Equipment — The 256-LBGA (17×17) package allows integration into space-constrained PCBs where a balance of logic density and I/O is required.

Unique Advantages

• Substantial Logic Density: 13,824 logic elements provide the capacity to implement complex custom digital functions without external ASICs.
• Generous I/O Count: 177 I/Os enable broad peripheral connectivity and flexible interfacing options for system-level integration.
• On-Chip Memory: Approximately 0.11 Mbits of embedded RAM reduces dependence on external memory for small buffers and state storage.
• Compact, Surface-Mount Package: 256-LBGA (256-FPBGA, 17×17) supports high-density board layouts and automated assembly processes.
• Predictable Power Envelope: Defined supply range of 1.425 V to 1.575 V simplifies power-supply design and voltage planning.
• RoHS Compliant: Meets environmental requirements for lead-free assembly in commercial products.

Why Choose M1AGL600V5-FGG256?

The M1AGL600V5-FGG256 positions itself as a commercially graded FPGA option that balances significant logic resources, ample I/O, and embedded memory within a compact 256-LBGA footprint. Its defined supply voltage range and commercial temperature rating make it suitable for a wide range of commercial embedded designs that require reprogrammable digital logic and moderate on-chip storage.

Designed and supplied by Microchip Technology, this IGLOO FPGA offers a pragmatic combination of integration and predictable electrical/thermal characteristics for teams developing prototypes and production systems where space, I/O count, and reconfigurability are primary considerations.

Request a quote or contact sales to check availability, pricing, and lead times for the M1AGL600V5-FGG256.