M2GL010TS-1FG484

IC FPGA 233 I/O 484FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 233 933888 12084 484-BGA

Quantity 123 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O233Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs12084Number of Logic Elements/Cells12084
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits933888

Overview of M2GL010TS-1FG484 – IGLOO2 Field Programmable Gate Array (FPGA) 484-BGA

The M2GL010TS-1FG484 is an IGLOO2 field programmable gate array (FPGA) IC from Microchip Technology. It integrates 12,084 logic elements, approximately 0.934 Mbits of embedded memory and 233 I/O pins in a compact 484-FPBGA (23×23) package.

Designed for surface-mount assembly, the device supports a supply voltage range of 1.14 V to 2.625 V and operates over a commercial temperature range of 0 °C to 85 °C. The part is RoHS compliant.

Key Features

  • Core logic: 12,084 logic elements providing reconfigurable digital logic capacity for custom implementations.
  • Embedded memory: Approximately 0.934 Mbits of on-chip RAM for buffering, FIFOs and intermediate data storage.
  • I/O density: 233 programmable I/O pins to support multiple external interfaces and signal sets.
  • Power supply: Operates from 1.14 V to 2.625 V to accommodate a range of system power rails.
  • Package and mounting: 484-FPBGA (23×23) package, surface-mount mounting for compact board integration.
  • Temperature and grade: Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Compliance: RoHS compliant for environmental and regulatory considerations.

Typical Applications

  • General-purpose digital logic: Implement custom processing, state machines and glue logic using 12,084 logic elements and flexible I/O.
  • I/O-intensive interfaces: Use the 233 I/O pins for protocol bridging, signal aggregation and multi-channel interfacing.
  • On-chip data buffering: Leverage approximately 0.934 Mbits of embedded RAM for temporary storage, FIFO buffering and small data sets.

Unique Advantages

  • Balanced logic and memory capacity: Combines 12,084 logic elements with substantial on-chip RAM to support mixed logic and data tasks.
  • High I/O count: 233 I/O pins enable extensive external connectivity without immediate need for additional I/O expanders.
  • Compact BGA footprint: 484-FPBGA (23×23) package enables a high-density board layout while maintaining a large number of I/Os.
  • Flexible supply range: 1.14 V to 2.625 V operation allows integration into systems with a variety of core and I/O supply rails.
  • Commercial temperature rating: 0 °C to 85 °C specification aligns with a wide range of standard electronic designs.
  • RoHS compliant: Meets common environmental compliance requirements for modern product designs.

Why Choose M2GL010TS-1FG484?

The M2GL010TS-1FG484 positions itself as a mid-density IGLOO2 FPGA that delivers a combination of reconfigurable logic, on-chip memory and substantial I/O in a single 484-FPBGA package. Its supported voltage range and commercial temperature rating make it suitable for designs that require moderate logic capacity and significant external connectivity in a compact form factor.

This device is appropriate for designers seeking a programmable logic solution with defined resource counts—12,084 logic elements, approximately 0.934 Mbits of embedded RAM and 233 I/Os—paired with surface-mount packaging and RoHS compliance for streamlined board integration.

Request a quote or contact sales to discuss availability, pricing and any specific requirements for integrating the M2GL010TS-1FG484 into your design.

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