M2GL010TS-1FG484M
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 233 933888 12084 484-BGA |
|---|---|
| Quantity | 819 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 233 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 12084 | Number of Logic Elements/Cells | 12084 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | MIL-STD-883 | Total RAM Bits | 933888 |
Overview of M2GL010TS-1FG484M – IGLOO2 FPGA, 484-BGA Military Grade
The M2GL010TS-1FG484M is an IGLOO2 field programmable gate array (FPGA) in a 484-ball BGA package, designed for applications that require military-grade qualification and extended operating conditions. It provides a balance of logic capacity, embedded memory, and I/O density suitable for rugged embedded systems.
With 12,084 logic elements, approximately 0.934 Mbits of on-chip RAM, and 233 I/O, this device supports custom digital functions where reliability across a wide temperature range and MIL-STD-883 qualification are key considerations.
Key Features
- Logic Capacity 12,084 logic elements for implementing custom FPGA-based processing, control and glue-logic functions.
- Embedded Memory Approximately 0.934 Mbits of on-chip RAM to support buffering, state machines and local data storage.
- I/O Density 233 I/O pins to interface with peripherals, sensors and high-pin-count system buses.
- Power Supply Range Flexible voltage operation from 1.14 V to 2.625 V to accommodate various system power rails.
- Package 484-ball FPBGA package (23×23) for a compact board footprint and high signal density.
- Temperature Range Qualified for operation from −55 °C to 125 °C to meet sustained extreme-environment requirements.
- Military Qualification MIL-STD-883 qualification and military grade classification for use in defense and avionics applications.
- Mounting Surface-mount package suitable for modern PCB assembly and ruggedized electronics.
Typical Applications
- Military and Aerospace Systems Implement mission-critical logic and interfaces that require MIL-STD-883 qualification and extended temperature operation.
- Embedded Control Use the device’s logic elements and on-chip RAM for custom control algorithms, state machines and timing logic in rugged platforms.
- Signal and Data Conditioning Leverage available I/O and memory for buffering, protocol bridging and pre-processing of sensor or telemetry data.
- Communications Equipment Implement custom packet handling, interface adaptation or control functions where high I/O count and reliable operation are required.
Unique Advantages
- Military-Grade Qualification: MIL-STD-883 qualification and −55 °C to 125 °C operating range provide confidence for deployment in defense and aerospace environments.
- Balanced Logic and Memory: 12,084 logic elements paired with approximately 0.934 Mbits of embedded RAM support mid-density designs without external memory for many control and processing tasks.
- High I/O Count: 233 I/O enable broad interfacing options to sensors, actuators and external peripherals, reducing the need for additional interface components.
- Flexible Power Envelope: Wide supply range (1.14 V to 2.625 V) allows integration into a variety of system power architectures.
- Compact, Rugged Package: 484-FPBGA (23×23) offers a space-efficient footprint with high pin density suitable for constrained board designs.
Why Choose M2GL010TS-1FG484M?
The M2GL010TS-1FG484M is positioned for designers who need a qualified, reliable FPGA solution with a mid-range logic capacity, substantial on-chip RAM, and high I/O density in a compact BGA package. Its military-grade qualification, wide operating temperature and flexible supply range make it well suited for defense, aerospace and other high-reliability embedded systems.
This device delivers a combination of integration and environmental robustness that helps reduce system-level risk and BOM complexity for long-life and mission-critical designs.
Request a quote or submit a purchase inquiry to get pricing and availability information for the M2GL010TS-1FG484M.

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