M2GL010TS-1FGG484
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 233 933888 12084 484-BGA |
|---|---|
| Quantity | 895 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 233 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 12084 | Number of Logic Elements/Cells | 12084 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 933888 |
Overview of M2GL010TS-1FGG484 – IGLOO2 FPGA, 12,084 logic elements, 233 I/O, 484-BGA
The M2GL010TS-1FGG484 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology, offering 12,084 logic elements and approximately 0.93 Mbits of embedded RAM. It provides a balanced combination of logic capacity, on-chip memory, and I/O density in a compact 484-ball BGA package for commercial-grade applications.
With support for up to 233 I/O pins and a supply range of 1.14 V to 2.625 V, this surface-mount device suits designs that require programmable logic, local embedded memory, and dense external interfacing within a 23 × 23 484-FPBGA footprint.
Key Features
- Core Logic 12,084 logic elements for implementing moderate-complexity custom logic and control functions.
- Embedded Memory Approximately 0.93 Mbits of on-chip RAM to support buffering, state machines, and local data storage.
- I/O Density Up to 233 general-purpose I/O pins to connect multiple peripherals, sensors, and external devices.
- Power Flexible supply voltage range from 1.14 V to 2.625 V to accommodate different rail architectures.
- Package & Mounting 484-ball FPBGA (23 × 23) package, surface-mount for compact PCB integration.
- Operating Range Commercial grade operation from 0 °C to 85 °C.
- Regulatory RoHS compliant.
Typical Applications
- Custom Logic and Prototyping Implement state machines, protocol converters, and glue logic using the device’s 12,084 logic elements and embedded RAM.
- High-Density I/O Control Manage and multiplex multiple external signals or peripherals leveraging up to 233 I/O pins.
- On-Device Data Buffering Use the approximately 0.93 Mbits of embedded RAM for temporary data storage, FIFOs, or small buffering tasks.
- Space-Constrained Board Designs The 484-FPBGA (23 × 23) surface-mount package enables high integration in compact PCBs.
Unique Advantages
- Balanced Logic and Memory 12,084 logic elements paired with ~0.93 Mbits of RAM provide a practical mix for control and data-handling tasks without external memory.
- High I/O Count 233 available I/O pins simplify external interfacing and reduce the need for additional I/O expanders.
- Flexible Power Integration Wide supply range (1.14 V–2.625 V) supports integration with a variety of power-rail schemes.
- Compact, Assembly-Friendly Package 484-FPBGA surface-mount package supports dense board layouts while enabling automated assembly.
- Commercial Temperature Suitability Rated for 0 °C to 85 °C operation to match standard commercial deployments.
- RoHS Compliance Designed to meet RoHS requirements for lead-free assemblies.
Why Choose M2GL010TS-1FGG484?
The M2GL010TS-1FGG484 IGLOO2 FPGA delivers a practical combination of logic capacity, embedded RAM, and high I/O count in a compact 484-FPBGA package. Its voltage flexibility and surface-mount form factor make it suitable for commercial designs that need programmable logic, local memory, and dense interfacing without sacrificing board space.
Backed by Microchip Technology, this device is appropriate for designers seeking a commercially rated FPGA that balances integration and board-level efficiency while remaining RoHS compliant and straightforward to assemble in modern manufacturing flows.
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