M2GL025-1FCSG325I

The M2GL025-1FCSG325I is an IGLOO2 field programmable gate array (FPGA) offered in a 325-FCBGA, surface-mount package. It provides a balance of logic capacity, embedded memory, and I/O for industrial-grade applications.

Key on-chip resources include 27,696 logic elements, approximately 1.13 Mbits of embedded RAM, and 180 I/O pins. The device supports supply voltages from 1.14 V to 2.625 V and a qualified operating range of −40 °C to 100 °C.

Key Features

• Logic Capacity  27,696 logic elements providing the device's core programmable fabric for custom digital logic implementation.
• Embedded Memory  Approximately 1.13 Mbits of on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O  180 general-purpose I/O pins to interface with external peripherals and system signals.
• Power Supply  Supports a wide supply range from 1.14 V to 2.625 V to accommodate different I/O and core voltage domains.
• Package & Mounting  Packaged in a 325-FCBGA (11×11) ball grid array and designed for surface-mount assembly.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance  RoHS-compliant construction for environmental and regulatory conformity.

Unique Advantages

• Substantial logic resources: 27,696 logic elements enable implementation of complex custom logic and integration of multiple functions on a single device, reducing board-level components.
• Integrated memory: Approximately 1.13 Mbits of embedded RAM supports local data storage and buffering to improve system responsiveness without external memory.
• Flexible I/O capacity: 180 I/Os allow broad interfacing options for sensors, peripherals, and control signals in compact system designs.
• Broad supply compatibility: The 1.14 V to 2.625 V range permits use in systems with varied supply domains and simplifies power rail planning.
• Industrial temperature range: Rated for −40 °C to 100 °C operation, suitable for deployments requiring extended temperature tolerance.
• Compact, surface-mount package: The 325-FCBGA (11×11) package delivers high pin density in a compact footprint for space-constrained designs.

Why Choose M2GL025-1FCSG325I?

The M2GL025-1FCSG325I positions itself as a versatile IGLOO2 FPGA option where a combination of mid-range logic capacity, embedded memory, and substantial I/O is required within an industrial temperature envelope. Its supply voltage flexibility and surface-mount 325-FCBGA package make it suitable for compact, robust designs that need on-chip resources to reduce system complexity.

Choose this device when you need a single-chip programmable solution that balances integration and environmental tolerance, backed by documented device specifications for design and procurement decisions.

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