M2GL025T-1FCS325

The M2GL025T-1FCS325 is an IGLOO2 Field Programmable Gate Array (FPGA) IC provided in a 325-TFBGA (325-FCBGA, 11×11) package. It offers a balance of programmable logic capacity, on-chip memory, and I/O density for commercial electronic designs.

With 27,696 logic elements, approximately 1.13 Mbits of embedded memory and 180 user I/O pins, this device is suited to commercial applications that require flexible, reconfigurable logic while operating within a 1.14 V to 2.625 V supply range and a 0 °C to 85 °C temperature window.

Key Features

• Core Logic  27,696 logic elements provide programmable resources for implementing custom logic, state machines, and data-paths.
• Embedded Memory  Approximately 1.13 Mbits of on-chip RAM for buffering, lookup tables, and small data stores directly within the FPGA fabric.
• I/O Capacity  180 I/O pins support external interfaces and signal routing to peripheral devices and subsystems.
• Power Supply Range  Operates from 1.14 V to 2.625 V, enabling use with a variety of system power rails within that range.
• Package and Mounting  Available in a 325-TFBGA (325-FCBGA, 11×11) surface-mount package for compact PCB implementations.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operation.
• Regulatory Compliance  RoHS compliant, supporting lead-free manufacturing requirements.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic, protocol handling, or glue logic where reprogrammability and integration density are required.
• Prototyping and Evaluation  Use the FPGA’s logic and memory resources to validate algorithms, interfaces, and system partitioning before committing to fixed silicon.
• I/O Expansion and Custom Interfaces  Leverage 180 I/O pins to create or adapt interfaces between processors, sensors, and peripherals in compact designs.

Unique Advantages

• Substantial Logic Capacity: 27,696 logic elements enable implementation of complex logic functions and moderate-scale systems on a single device.
• On-Chip Memory: Approximately 1.13 Mbits of embedded RAM reduces dependency on external memory for buffering and temporary storage.
• High I/O Count: 180 I/O pins provide flexibility for multiple parallel interfaces and signal routing without additional I/O expanders.
• Compact Surface-Mount Package: The 325-TFBGA (11×11) package supports space-constrained PCB layouts while preserving robust connectivity.
• Wide Supply Compatibility: Support for 1.14 V to 2.625 V supplies accommodates a range of system power architectures.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match typical commercial product environments.

Why Choose M2GL025T-1FCS325?

The M2GL025T-1FCS325 delivers a balanced combination of logic density, on-chip memory, and I/O capacity in a compact 325-TFBGA surface-mount package. Its specification set—27,696 logic elements, approximately 1.13 Mbits of embedded memory, 180 I/O pins, and a 1.14 V to 2.625 V supply range—makes it appropriate for commercial designs that require reconfigurable logic and system-level integration.

Designed for engineers and procurement teams targeting commercial embedded applications, this IGLOO2 FPGA supports scalable implementation of custom logic, interface adaptation, and early-stage prototype development while meeting RoHS requirements and standard commercial operating conditions.

Request a quote or submit an inquiry to obtain pricing and availability for the M2GL025T-1FCS325. Our team can assist with lead times and order placement.