M2GL025T-1FCSG325
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 180 1130496 27696 325-TFBGA, FCBGA |
|---|---|
| Quantity | 985 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 325-FCBGA (11x11) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 325-TFBGA, FCBGA | Number of I/O | 180 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 27696 | Number of Logic Elements/Cells | 27696 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1130496 |
Overview of M2GL025T-1FCSG325 – IGLOO2 Field Programmable Gate Array (FPGA)
The M2GL025T-1FCSG325 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a programmable-logic solution with a defined set of on-chip resources and I/O in a compact BGA package.
This device includes 27,696 logic elements and approximately 1.13 Mbits of embedded memory, supports up to 180 I/Os, and is offered in a 325-FCBGA (11×11) surface-mount package. It operates from a 1.14 V to 2.625 V supply range and is rated for commercial temperatures from 0°C to 85°C.
Key Features
- Programmable Logic Capacity — 27,696 logic elements for implementing custom digital logic and finite-state machines.
- Embedded Memory — Approximately 1.13 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage.
- I/O Count — Up to 180 general-purpose I/Os to interface with peripherals and external devices.
- Power Supply Range — Supports supply voltages from 1.14 V to 2.625 V to accommodate different board-level power schemes.
- Package & Mounting — 325-TFBGA / 325-FCBGA (11×11) surface-mount package for compact, high-density board designs.
- Temperature & Grade — Commercial grade operation from 0°C to 85°C suitable for standard electronics applications.
- RoHS Compliant — Meets RoHS environmental requirements.
Typical Applications
- Custom Digital Logic Prototyping: Use the 27,696 logic elements and embedded memory to prototype and validate custom logic functions and accelerators.
- Interface Bridging and Protocol Conversion: Up to 180 I/Os enable implementation of multi-protocol bridges and peripheral interfaces on a single device.
- Embedded Control and Sequencing: Implement control state machines, timing logic, and local signal processing using the device’s logic and on-chip RAM resources.
- Compact, High-density Board Designs: The 325-FCBGA (11×11) surface-mount package supports space-constrained designs that require significant logic and I/O capacity.
Unique Advantages
- High Logic Capacity: 27,696 logic elements give designers the headroom to implement complex logic functions without external glue logic.
- On-chip Memory: Approximately 1.13 Mbits of RAM reduces reliance on external memory for buffering and small data storage tasks.
- Generous I/O Count: 180 I/Os provide flexibility to connect multiple peripherals, sensors, and interface buses directly to the FPGA.
- Flexible Power Options: Wide supply range (1.14 V to 2.625 V) supports various board power architectures and IO voltage domains.
- Compact Package: 325-FCBGA (11×11) surface-mount packaging enables dense PCB layouts and small form-factor implementations.
- Commercial-grade Reliability and Compliance: Rated for 0°C to 85°C operation and RoHS compliant for standard electronic product use.
Why Choose M2GL025T-1FCSG325?
The M2GL025T-1FCSG325 positions itself as a practical IGLOO2 FPGA option for designs that require substantial programmable logic, embedded memory, and a high I/O count in a compact footprint. Its combination of 27,696 logic elements, approximately 1.13 Mbits of on-chip RAM, and up to 180 I/Os makes it suitable for projects that need integrated digital logic and interface density without expanding component count.
As a commercial-grade, RoHS-compliant device in a 325-FCBGA (11×11) surface-mount package, this FPGA is well suited to standard electronics applications where board space, power flexibility, and on-chip resources are key considerations.
Request a quote or contact sales to discuss availability, pricing, and how the M2GL025T-1FCSG325 can fit into your next design.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D