M2GL025T-1FCSG325I

The M2GL025T-1FCSG325I is an IGLOO2 field programmable gate array (FPGA) provided in a 325‑TFBGA (325‑FCBGA, 11×11) surface‑mount package. It delivers a configurable hardware fabric with 27,696 logic elements, approximately 1.13 Mbits of embedded memory, and 180 general‑purpose I/Os, making it suitable for demanding industrial applications that require on‑device logic, memory and I/O integration.

Key Features

• Core Logic 27,696 logic elements for implementing custom digital functions, state machines and glue logic.
• Embedded Memory Approximately 1.13 Mbits of on‑chip RAM to support buffering, FIFOs and local data storage.
• I/O Density 180 I/O pins to connect sensors, peripherals and external devices without extensive external logic.
• Power Supply Range Operates from 1.14 V to 2.625 V, allowing flexibility in system power architectures.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Package & Mounting 325‑TFBGA / 325‑FCBGA (11×11) surface‑mount package for compact board integration.
• Compliance RoHS‑compliant construction to align with common environmental requirements.

Typical Applications

• Industrial control and automation — Use the 27,696 logic elements and wide operating temperature range (−40 °C to 100 °C) to implement custom control logic and interface with industrial equipment.
• Sensor interfacing and data acquisition — 180 I/Os combined with approximately 1.13 Mbits of on‑chip RAM support multi‑channel sensor inputs, buffering and preprocessing on‑device.
• I/O aggregation and protocol bridging — High I/O count and programmable logic capacity simplify consolidating multiple interfaces or implementing protocol translation without extra components.
• Embedded configurable logic — Implement custom peripheral functions, timing-critical logic, or application‑specific acceleration using the device’s logic and embedded memory resources.

Unique Advantages

• High logic density: 27,696 logic elements enable substantial custom digital design within a single FPGA, reducing external component count.
• On‑chip memory capacity: Approximately 1.13 Mbits of embedded RAM supports local buffering and state storage for responsive processing.
• Robust I/O capability: 180 I/Os allow direct connection to multiple peripherals and sensors, streamlining board design.
• Flexible power envelope: Broad supply voltage range (1.14 V–2.625 V) fits a variety of system power schemes.
• Industrial suitability: Rated for −40 °C to 100 °C operation to meet common industrial deployment needs.
• Compact surface‑mount package: 325‑FCBGA (11×11) enables space‑efficient integration on modern PCBs.

Why Choose M2GL025T-1FCSG325I?

The M2GL025T-1FCSG325I positions itself as a versatile, industrial‑grade FPGA option that combines substantial logic resources, embedded memory and a high I/O count in a compact surface‑mount 325‑TFBGA/FCBGA package. It is well suited to engineers and system designers who need an integrated, configurable hardware building block for industrial control, sensor interfacing, I/O consolidation and other embedded logic tasks across a wide operating temperature range.

Its combination of logic density, on‑chip memory and flexible supply voltage makes it a practical choice for designs that require long‑term scalability and durable operation in industrial environments.

Request a quote or submit an inquiry to obtain pricing, availability and lead‑time information for the M2GL025T-1FCSG325I. Sales and ordering details are available on request.